Substrate processing apparatus

ABSTRACT

A substrate processing apparatus includes a driving magnet that is disposed correspondingly to a movable pin and that has a predetermined polar direction with respect to a radial direction of a rotary table, a pressing magnet that has a magnetic pole that gives an attractive magnetic force or a repulsive magnetic force between the driving magnet and the pressing magnet and that presses a support portion against a peripheral edge of a substrate by urging the support portion toward a contact position by means of the attractive magnetic force or the repulsive magnetic force, and a pressing-force changing unit that changes a magnitude of a pressing force against the peripheral edge of the substrate pressed by the support portion while keeping the magnitude higher than zero in response to rotation of the rotary table.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. patent applicationSer. No. 15/422,858, filed Feb. 2, 2017, which claims priority toJapanese Patent Application No. 2016-030153, filed Feb. 19, 2016, thecontents of all of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a substrate processing apparatus and asubstrate processing method. Examples of substrates to be processedinclude semiconductor wafers, substrates for liquid crystal displaydevices, substrates for plasma displays, substrates for FEDs (fieldemission displays), substrates for optical disks, substrates formagnetic disks, substrates for magneto-optical disks, and substrates forphotomasks, ceramic substrates, substrates for solar cells.

2. Description of Related Art

US2013/0152971 A1 discloses a rotating type substrate holding/rotatingdevice that includes a rotary table rotatable around a rotational axisaligned with a vertical direction, a rotation driving unit that rotatesthe rotary table around the rotational axis, and a plurality (forexample, four) of holding pins disposed on the rotary table andhorizontally positioning a substrate across a prescribed interval from afront surface of the rotary table.

The plurality of holding pins include fixed pins that are immovable withrespect to the rotary table and movable pins that are movable withrespect to the rotary table. Each movable pin has a contacting portionarranged to be rotatable around a rotational axis coaxial to a centralaxis of the movable pin and arranged to contact a peripheral end edge ofthe substrate. By rotation of the contacting portion, the contactingportion is displaced between an open position that is far apart from therotational axis and a hold position that has approached the rotationalaxis. A pin driving magnet is coupled to a rotating shaft of thecontacting portion.

Switching between opening and closing of the movable pins is performedusing an elevated/lowered magnet disposed below the rotary table (magnetswitching type). A magnet elevating/lowering unit is coupled to theelevated/lowered magnet. When the elevated/lowered magnet is at aprescribed lower position, the elevated/lowered magnet does not face thepin driving magnets and an external force, which urges the movable pinsto the hold position, does not act on the movable pins. Therefore, whenthe elevated/lowered magnet is at the lower position, the movable pinsare held at the open position. On the other hand, when theelevated/lowered magnet is at a prescribed upper position, the movablepins are held at the hold position by a magnetic attractive forcebetween the elevated/lowered magnet and the pin driving magnets.

SUMMARY OF THE INVENTION

The substrate holding/rotating device is installed in a single substrateprocessing type apparatus that processes substrates one at a time and aprocessing liquid (cleaning chemical liquid) is supplied from aprocessing liquid nozzle to an upper surface of a substrate beingrotated by the holding/rotating device. The processing liquid suppliedto the upper surface of the substrate receives a centrifugal force dueto rotation of the substrate and flows toward a peripheral edge portionof the substrate. The entirety of the upper surface of substrate and aperipheral end surface of the substrate is thereby liquid-processed.Also, depending on the type of substrate processing, a peripheral edgeportion of a lower surface of the substrate may also be desired to beliquid-processed.

However, in the arrangement of US2013/0152971 A1, the substrate is beingsupported by the plurality of (e.g., four) holding pins while being incontact with the holding pins from beginning to end during the liquidtreatment, and therefore there is a possibility that the processingliquid will not flow around at a plurality of contact positions of theholding pins in the peripheral end surface of the substrate, and theremainder after processing will be generated at the peripheral edge ofthe substrate (i.e., the peripheral end surface of the substrate and theperipheral edge of the lower surface of the substrate).

The inventors of the present invention are considering that, when asubstrate is subjected to rotation processing (liquid processing),contact-support positions in the peripheral edge of the substrate aredisplaced in the circumferential direction while the peripheral edge ofthe substrate is being in contact with holding pins and is beingsupported by the holding pins.

Therefore, it is an object of the present invention to provide asubstrate processing apparatus and a substrate processing method thatare capable of displacing contact-support positions in the peripheraledge of a substrate in the circumferential direction while theperipheral edge of the substrate is being in contact with holding pinsand is being supported by the holding pins when the substrate issubjected to rotation processing and, as a result, capable ofexcellently processing the peripheral edge of the substrate without theremainder after processing.

The present invention provides a substrate processing apparatus thatincludes a rotary table, and a substrate rotation holding device that isdisposed to rotate around a rotational axis along a vertical directiontogether with the rotary table and that includes a plurality of supportpins to support a substrate horizontally, and wherein the support pinincluding a movable pin that has a support portion disposed movablybetween a contact position at which the support pin comes into contactwith a peripheral edge of the substrate and an open position that ismore distant from the rotational axis than the contact position, furtherincludes a driving magnet that is disposed correspondingly to themovable pin and that has a predetermined polar direction with respect toa radial direction of the rotary table, a pressing magnet that has amagnetic pole that gives an attractive magnetic force or a repulsivemagnetic force between the driving magnet and the pressing magnet andthat presses the support portion against the peripheral edge of thesubstrate by urging the support portion toward the contact position bymeans of the attractive magnetic force or the repulsive magnetic force,and a pressing-force changing unit that changes a magnitude of apressing force against the peripheral edge of the substrate pressed bythe support portion while keeping the magnitude higher than zero inresponse to rotation of the rotary table.

According to this arrangement, the support portion of the movable pin ispressed against the peripheral edge of the substrate with apredetermined pressing force by means of a magnetic force generatedbetween the driving magnet and the pressing magnet corresponding to thisdriving magnet. As a result, the substrate is gripped in the horizontaldirection by means of the plurality of support pins. The substrate isrotated around the rotational axis by rotating the support pin and therotary table around the rotational axis in this state, and a centrifugalforce generated by the rotation acts on the peripheral edge of thesubstrate.

Additionally, the magnitude of a pressing force against the peripheraledge of the substrate applied by the movable pin is changed while beingkept higher than zero in response to rotation of the rotary table. As aresult, the substrate being in a rotational state becomes eccentric.This eccentric direction of the substrate changes in accordance with therotational angle position of the substrate being in a rotational state.

As thus described, the substrate becomes eccentric in a state of beingrotated, and the eccentric direction changes in accordance with therotational angle position of the substrate being in a rotational state,and the operation of a centrifugal force acting on the peripheral edgeof the substrate enables the substrate supported by the plurality ofsupport pins to turn relatively and slightly in a circumferentialdirection opposite to the rotational direction of the substrate withrespect to the rotary table. The amount of relative turning of thesubstrate is increased by allowing the rotary table to rotatecontinuously. As a result, it is possible to displace thecontact-support position in the peripheral edge of the substratesupported by the support pin in the circumferential direction whileallowing the plurality of support pins to come into contact with andsupport the peripheral edge of the substrate when the substrate isundergoing rotation processing. Therefore, it is possible to provide asubstrate processing apparatus that is capable of excellently processingthe peripheral edge of the substrate without the remainder afterprocessing.

In the present preferred embodiment, the pressing-force changing unitincludes a magnetic-force generating magnet that is a magnet differingfrom the pressing magnet and that has a magnetic pole that gives anattractive magnetic force or a repulsive magnetic force to urge thesupport portion toward the open position between the driving magnet andthe magnetic-force generating magnet, a magnet drive unit that drivesthe magnetic-force generating magnet, a rotating/driving unit thatrelatively rotates the rotary table and the magnetic-force generatingmagnet around the rotational axis, and a pressing-force changing controlunit that changes the magnitude of the pressing force applied by thesupport portion while controlling the magnet drive unit and therotating/driving unit and while keeping the magnitude higher than zero,and the pressing-force changing control unit performs a magnetic-forcegeneration-position placing step of placing the magnetic-forcegenerating magnet at a first position at which an attractive magneticforce or a repulsive magnetic force having a smaller magnitude than anattractive magnetic force or a repulsive magnetic force generatedbetween the driving magnet and the pressing magnet is generated betweenthe driving magnet and the magnetic-force generating magnet, and arotation step of relatively rotating the rotary table and themagnetic-force generating magnet around the rotational axis in a statein which the magnetic-force generating magnet is placed at the firstposition.

According to this arrangement, the substrate processing apparatusincludes a magnetic-force generating magnet that has a magnetic polethat gives an attractive magnetic force or a repulsive magnetic force tourge the support portion toward the open position. The magnetic-forcegenerating magnet is placed at a first position at which an attractivemagnetic force or a repulsive magnetic force having a smaller magnitudethan an attractive magnetic force or a repulsive magnetic forcegenerated between the driving magnet and the pressing magnet isgenerated between the driving magnet and the magnetic-force generatingmagnet. Furthermore, the rotary table and the magnetic-force generatingmagnet are relatively rotated around the rotational axis in a state inwhich the magnetic-force generating magnet is placed at the firstposition. The substrate is also rotated around the rotational axis inresponse to the rotation of the rotary table around the rotational axis.

In this case, the distance between the driving magnet and themagnetic-force generating magnet changes in accordance with therotational angle position of the substrate, i.e., the magnitude of amagnetic force (attractive magnetic force or repulsive magnetic force)that is given from the magnetic-force generating magnet and that acts onthe driving magnet also changes in accordance with the rotational angleposition of the substrate. This makes it possible to change a magneticforce (attractive magnetic force or repulsive magnetic force) generatedbetween the driving magnet and the magnetic-force generating magnet inresponse to rotation of the substrate.

Moreover, in a state in which the magnetic-force generating magnet isplaced at the first position, the magnitude of a magnetic force(attractive magnetic force or repulsive magnetic force) generatedbetween the driving magnet and the magnetic-force generating magnet issmaller than that of a magnetic force (attractive magnetic force orrepulsive magnetic force) generated between the driving magnet and thepressing magnet. Therefore, it is possible to change the magnitude of apressing force against the peripheral edge of the substrate applied bythe support portion of the movable pin while keeping its magnitudehigher than zero in response to rotation of the rotary table.

The magnetic-force generating magnet may include a first magnetic-forcegenerating magnet and a second magnetic-force generating magnet both ofwhich have mutually different polar directions with respect to theradial direction of the rotary table, and the first magnetic-forcegenerating magnet and the second magnetic-force generating magnet may bealternately disposed in a circumferential direction.

According to this arrangement, the first magnetic-force generatingmagnet and the second magnetic-force generating magnet are alternatelydisposed in the circumferential direction, and therefore the magneticpole of a magnetic field given to the driving magnet changes in responseto rotation of the rotary table (the magnetic field is nonuniform). Inthis case, it is possible to abruptly change a magnetic force generatedbetween each driving magnet and the magnetic-force generating magnet(the first magnetic-force generating magnet or the second magnetic-forcegenerating magnet) in accordance with the rotational angle position ofthe substrate. Therefore, it is possible to largely change a magneticforce generated between each driving magnet and the magnetic-forcegenerating magnet in response to rotation of the substrate, and it ispossible to accelerate the turning of the substrate. This makes itpossible to even more effectively displace the contact-support positionsin the peripheral edge of the substrate supported by the support pins inthe circumferential direction.

The magnetic-force generating magnet may include a plurality ofmagnetic-force generating magnets that have mutually identical polardirections with respect to the radial direction of the rotary table, andthe plurality of magnetic-force generating magnets may be spaced out ina circumferential direction.

According to this arrangement, the plurality of magnetic-forcegenerating magnets are spaced out in the circumferential direction, andtherefore the magnitude of a magnetic field given to the driving magnetchanges in response to rotation of the rotary table (the magnetic fieldis nonuniform). In this case, it is possible to abruptly change amagnetic force generated between each driving magnet and themagnetic-force generating magnet in accordance with the rotational angleposition of the substrate. Therefore, it is possible to largely change amagnetic force generated between each driving magnet and themagnetic-force generating magnet in response to rotation of thesubstrate, and it is possible to accelerate the turning of thesubstrate. This makes it possible to even more effectively displace thecontact-support positions in the peripheral edge of the substratesupported by the support pins in the circumferential direction.

The magnet drive unit may include a magnet moving unit that moves themagnetic-force generating magnet between the first position and a secondposition at which a magnetic field is not generated between the drivingmagnet and the magnetic-force generating magnet.

According to this arrangement, the magnet moving unit allows themagnetic-force generating magnet to be moved between the first positionand the second position, and, as a result, it is possible to make atransition between a state in which the contact-support position in theperipheral edge of the substrate deviates and a state in which thecontact-support position in the peripheral edge of the substrate doesnot deviate during rotation processing. The amount of displacement inthe circumferential direction of the substrate is proportional to thelength of time during which the magnetic-force generating magnet isplaced at the first position, and therefore the magnetic-forcegenerating magnet is moved from the first position to the secondposition in a state in which a predetermined period of time has elapsedafter placing the magnetic-force generating magnet at the firstposition, and, as a result, it is possible to control the amount ofdisplacement in the circumferential direction of the substrate so as tobe set at a desired amount.

The substrate processing apparatus may further include a processingliquid supply unit that supplies a processing liquid to an upper surfaceof the substrate. In this case, the pressing-force changing control unitmay perform a processing-liquid supply step of controlling and allowingthe processing liquid supply unit to supply a processing liquid to theupper surface of the substrate in parallel to the rotation step.

According to this arrangement, a processing liquid is supplied to theupper surface of the substrate in parallel to rotation of the rotarytable with respect to the magnetic-force generating magnet. A load thatacts on the substrate is increased by the supply of the processingliquid to the upper surface of the substrate. When the substrate is in arotational state, the increase of the load acts on the substrate that isin contact with and that is supported by the plurality of support pinsas rotational resistance that obstructs the turning of the substrate.Therefore, it is possible to more effectively displace thecontact-support position in the peripheral edge of the substrate in thecircumferential direction.

The present invention provides a substrate processing method that isexecuted in a substrate processing apparatus, the substrate processingapparatus including a rotary table, a substrate rotation holding devicethat is disposed to rotate around a rotational axis along a verticaldirection together with the rotary table and that includes a pluralityof support pins to support a substrate horizontally, the support pinincluding a movable pin that has a support portion disposed movablybetween a contact position at which the support pin comes into contactwith a peripheral edge of the substrate and an open position that ismore distant from the rotational axis than the contact position, and adriving magnet that is disposed correspondingly to the movable pin andthat has a predetermined polar direction with respect to a radialdirection of the rotary table, the substrate processing method includinga pressing-force changing step of changing a magnitude of a pressingforce against the peripheral edge of the substrate pressed by thesupport portion while keeping the magnitude higher than zero in responseto rotation of the rotary table.

According to this method, the support portion of the movable pin ispressed against the peripheral edge of the substrate with apredetermined pressing force by means of a magnetic force generatedbetween the driving magnet and the pressing magnet corresponding to thisdriving magnet. As a result, the substrate is gripped in the horizontaldirection by means of the plurality of support pins. The substrate isrotated around the rotational axis by rotating the support pin and therotary table around the rotational axis in this state, and a centrifugalforce generated by the rotation acts on the peripheral edge of thesubstrate.

Additionally, the magnitude of a pressing force against the peripheraledge of the substrate applied by the movable pin is changed while beingkept higher than zero in response to rotation of the rotary table. As aresult, the substrate being in a rotational state becomes eccentric.This eccentric direction of the substrate changes in accordance with therotational angle position of the substrate being in a rotational state.

As thus described, the substrate becomes eccentric in a state of beingrotated, and the eccentric direction changes in accordance with therotational angle position of the substrate being in a rotational state,and the operation of a centrifugal force acting on the peripheral edgeof the substrate enables the substrate supported by the plurality ofsupport pins to turn relatively and slightly in a circumferentialdirection opposite to the rotational direction of the substrate withrespect to the rotary table. The amount of relative turning of thesubstrate is increased by allowing the rotary table to rotatecontinuously. As a result, it is possible to displace thecontact-support position in the peripheral edge of the substratesupported by the support pin in the circumferential direction whileallowing the plurality of support pins to come into contact with andsupport the peripheral edge of the substrate when the substrate isundergoing rotation processing. Therefore, it is possible to provide asubstrate processing method that is capable of excellently processingthe peripheral edge of the substrate without the remainder afterprocessing.

In the substrate processing method of the present invention, thepressing-force changing step may include a magnetic-forcegeneration-position placing step of placing a magnetic-force generatingmagnet that is a magnet differing from the pressing magnet and that hasa magnetic pole that gives an attractive magnetic force or a repulsivemagnetic force to urge the support portion toward the open positionbetween the driving magnet and the magnetic-force generating magnet at afirst position at which an attractive magnetic force or a repulsivemagnetic force having a smaller magnitude than an attractive magneticforce or a repulsive magnetic force generated between the driving magnetand the pressing magnet is generated between the driving magnet and themagnetic-force generating magnet, and a rotation step of relativelyrotating the rotary table and the magnetic-force generating magnetaround the rotational axis in a state in which the magnetic-forcegenerating magnet is placed at the first position.

According to this method, a magnetic-force generating magnet that has amagnetic pole that gives an attractive magnetic force or a repulsivemagnetic force to urge the support portion toward the open position isplaced at a first position at which an attractive magnetic force or arepulsive magnetic force having a smaller magnitude than an attractivemagnetic force or a repulsive magnetic force generated between thedriving magnet and the pressing magnet is generated between the drivingmagnet and the magnetic-force generating magnet. Furthermore, the rotarytable and the magnetic-force generating magnet are relatively rotatedaround the rotational axis in a state in which the magnetic-forcegenerating magnet is placed at the first position. The substrate is alsorotated around the rotational axis in response to the rotation of therotary table around the rotational axis.

In this case, the distance between the driving magnet and themagnetic-force generating magnet changes in accordance with therotational angle position of the substrate, i.e., the magnitude of amagnetic force (attractive magnetic force or repulsive magnetic force)that is given from the magnetic-force generating magnet and that acts onthe driving magnet also changes in accordance with the rotational angleposition of the substrate. This makes it possible to change a magneticforce (attractive magnetic force or repulsive magnetic force) generatedbetween the driving magnet and the magnetic-force generating magnet inresponse to rotation of the substrate.

Moreover, in a state in which the magnetic-force generating magnet isplaced at the first position, the magnitude of a magnetic force(attractive magnetic force or repulsive magnetic force) generatedbetween the driving magnet and the magnetic-force generating magnet issmaller than that of a magnetic force (attractive magnetic force orrepulsive magnetic force) generated between the driving magnet and thepressing magnet. Therefore, it is possible to change the magnitude of apressing force against the peripheral edge of the substrate applied bythe support portion of the movable pin while keeping its magnitudehigher than zero in response to rotation of the rotary table.

The substrate processing method may further include a magnet moving stepof moving the magnetic-force generating magnet between the firstposition and a second position at which a magnetic field is notgenerated between the driving magnet and the magnetic-force generatingmagnet.

According to this method, the magnet moving unit allows themagnetic-force generating magnet to be moved between the first positionand the second position, and, as a result, it is possible to make atransition between a state in which the contact-support position in theperipheral edge of the substrate deviates and a state in which thecontact-support position in the peripheral edge of the substrate doesnot deviate during rotation processing. The amount of displacement inthe circumferential direction of the substrate is proportional to thelength of time during which the magnetic-force generating magnet isplaced at the first position, and therefore the magnetic-forcegenerating magnet is moved from the first position to the secondposition in a state in which a predetermined period of time has elapsedafter placing the magnetic-force generating magnet at the firstposition, and, as a result, it is possible to control the amount ofdisplacement in the circumferential direction of the substrate so as tobe set at a desired amount.

The substrate processing method may further include a processing-liquidsupply step of allowing a processing liquid supply unit to supply aprocessing liquid to the upper surface of the substrate in parallel tothe rotation step.

According to this method, a processing liquid is supplied to the uppersurface of the substrate in parallel to rotation of the rotary tablewith respect to the magnetic-force generating magnet. A load that actson the substrate is increased by the supply of the processing liquid tothe upper surface of the substrate. When the substrate is in arotational state, the increase of the load acts on the substrate that isin contact with and that is supported by the plurality of support pinsas rotational resistance that obstructs the turning of the substrate.Therefore, it is possible to more effectively displace thecontact-support position in the peripheral edge of the substrate in thecircumferential direction.

The aforementioned or other objects, features, and effects of thepresent invention will be clarified by the following description ofpreferred embodiments with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustrative plan view for describing a layout of aninterior of a substrate processing apparatus according to a firstpreferred embodiment of the present invention.

FIG. 2 is an illustrative sectional view for describing an arrangementexample of a processing unit included in the substrate processingapparatus.

FIG. 3 is a plan view for describing a more specific arrangement of aspin chuck included in the substrate processing apparatus.

FIG. 4 is a bottom view of the arrangement of FIG. 3.

FIG. 5 is a sectional view taken along section line V-V of FIG. 3.

FIG. 6 is an enlarged sectional view showing a portion of thearrangement of FIG. 5 in enlarged manner.

FIG. 7 is an enlarged sectional view of the arrangement in a vicinity ofa movable pin included in the spin chuck.

FIG. 8 is a schematic view showing an open state of a movable pinincluded in a first movable pin group.

FIG. 9 is a schematic view showing a closed state of the movable pinincluded in the first movable pin group.

FIG. 10 is a schematic view showing a state of the movable pin includedin the first movable pin group resulting from the up-and-down movementof the first magnetic-force generating magnet.

FIG. 11 is a schematic view showing an open state of a movable pinincluded in a second movable pin group.

FIG. 12 is a schematic view showing a closed state of the movable pinincluded in the second movable pin group.

FIG. 13 is a schematic view showing a state of the movable pin includedin the second movable pin group resulting from the up-and-down movementof the second magnetic-force generating magnet.

FIGS. 14A and 14B are schematic views showing a state of a substratewhen the first and second magnetic-force generating magnets are eachdisposed at the upper position and when the rotary table is rotated.

FIGS. 15A and 15B are schematic views showing a state of the substratesubsequent to FIGS. 14A and 14B.

FIGS. 16A and 16B are schematic views showing a state of the substratesubsequent to FIGS. 15A and 15B.

FIGS. 17A and 17B are schematic views showing a state of the substratesubsequent to FIGS. 16A and 16B.

FIGS. 18A and 18B are schematic views showing a state of the substratesubsequent to FIGS. 17A and 17B.

FIG. 19 is a block diagram to describe an electrical configuration of amain part of the substrate processing apparatus.

FIG. 20 is a flowchart to describe one example of processing-liquidprocessing performed by the processing unit.

FIG. 21 is a time chart to describe the processing-liquid processing.

FIGS. 22A to 22H are pictorial views to describe a processing example ofthe processing-liquid processing.

FIG. 23 is a pictorial cross-sectional view to describe an arrangementexample of a processing unit included in a substrate processingapparatus according to a second preferred embodiment of the presentinvention.

FIG. 24 is a plan view to describe a more concrete arrangement of a spinchuck included in the processing unit.

FIG. 25 is a view showing a positional relationship between the firstand second driving permanent magnets and the first and secondmagnetic-force generating magnets when the rotary table is rotated inthe spin chuck.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

FIG. 1 is an illustrative plan view for describing a layout of aninterior of a substrate processing apparatus 1 according to a firstpreferred embodiment of the present invention.

The substrate processing apparatus 1 is a single substrate processingtype apparatus that processes disk-shaped substrates W such assemiconductor wafers, one at a time by a processing liquid or aprocessing gas. The substrate processing apparatus 1 includes load portsLP that hold a plurality of carriers C, a turnover unit TU that performsup/down turnover of the orientation of the substrate W, and a pluralityof processing units 2 that process the substrates W. The load ports LPand the processing units 2 are disposed across an interval in ahorizontal direction. The turnover unit TU is disposed on a transferpath of the substrates W that are transferred between the load ports LPand the processing units 2.

As shown in FIG. 1, the substrate processing apparatus 1 furtherincludes an indexer robot IR disposed between the load ports LP and theturnover unit TU, a center robot CR disposed between the turnover unitTU and the processing units 2, and a controller (pressing-force changingunit) 3 controlling operations of devices and opening/closing of valvesincluded in the substrate processing apparatus 1. The indexer robot IRtransfers a plurality of substrates W one by one from the carriers Cheld by the load ports LP to the turnover unit TU and transfers aplurality of substrates W one by one from the turnover unit TU to thecarriers C held by the load ports LP. Similarly, the center robot CRtransfers a plurality of substrates W one by one from the turnover unitTU to the processing units 2 and transfers a plurality of substrates Wone by one from the processing units 2 to the turnover unit TU. Thecenter robot CR further transfers substrates W among a plurality ofprocessing units 2.

The indexer robot IR includes a hand H1 that holds a substrate Whorizontally. The indexer robot IR moves the hand H1 horizontally.Further, the indexer robot IR elevates and lowers the hand H1 androtates the hand H1 around a vertical axis. Similarly, the center robotCR includes a hand H2 that holds a substrate W horizontally. The centerrobot CR moves the hand H2 horizontally. Further, the center robot CRelevates and lowers the hand H2 and rotates the hand H2 around avertical axis.

A substrate W is housed in a carrier C in a state where a front surfaceWa of the substrate W that is a device forming surface is faced upward(upward facing orientation). The controller 3 makes the substrate W betransferred by the indexer robot IR in the state where the front surfaceWa (see FIG. 2, etc.) is faced upward from the carrier C to the turnoverunit TU. The controller 3 then makes the substrate W be turned over bythe turnover unit TU. A rear surface Wb (see FIG. 2, etc.) of thesubstrate W is thereby faced upward. Thereafter, the controller 3 makesthe substrate W be transferred by the center robot CR in the state wherethe rear surface Wb is faced upward from the turnover unit TU to aprocessing unit 2. The controller 3 then makes the rear surface Wb ofthe substrate W be processed by the processing unit 2.

After the rear surface Wb of the substrate W has been processed, thecontroller 3 makes the substrate W be transferred by the center robot CRin the state where the rear surface Wb is faced upward from theprocessing unit 2 to the turnover unit TU. The controller 3 then makesthe substrate W be turned over by the turnover unit TU. The frontsurface Wa of the substrate W is thereby faced upward. Thereafter, thecontroller 3 makes the substrate W be transferred by the indexer robotIR in the state where the front surface Wa is faced upward from theturnover unit TU to a carrier C. The processed substrate W is therebyhoused in the carrier C. The controller 3 makes the indexer robot IR,etc., execute this series of operations repeatedly to make a pluralityof substrates W be processed one by one.

FIG. 2 is an illustrative sectional view for describing an arrangementexample of a processing unit 2 included in the substrate processingapparatus 1. FIG. 3 is a plan view for describing a more specificarrangement of a spin chuck 5 included in the substrate processingapparatus 1. FIG. 4 is a bottom view of the arrangement of FIG. 3. FIG.5 is a sectional view taken along section line V-V of FIG. 3. FIG. 6 isan enlarged sectional view showing a portion of the arrangement of FIG.5 in enlarged manner. FIG. 7 is an enlarged sectional view of thearrangement in a vicinity of a movable pin 110 included in the spinchuck 5.

As shown in FIG. 2, each processing unit 2 includes a box-shapedprocessing chamber 4 having an internal space, a spin chuck 5 holding asingle substrate W in a horizontal orientation inside the processingchamber 4 and rotating the substrate W around a vertical rotational axisA1 passing through a center of the substrate W, a chemical liquidsupplying unit (processing liquid supplying unit) 7 arranged to supply achemical liquid (processing liquid) toward an upper surface (rearsurface Wb) of the substrate W held by the spin chuck 5, a watersupplying unit (processing liquid supplying unit) 8 arranged to supplywater as a rinse liquid (processing liquid) to the upper surface of thesubstrate W held by the spin chuck 5, a protective gas supplying unit 12arranged to supply an inert gas as a protective gas to a lower surface(front surface Wa) of the substrate W held by the spin chuck 5, and acylindrical processing cup (not shown) surrounding the spin chuck 5.

As shown in FIG. 2, the processing chamber 4 includes a box-shapedpartition wall (not shown), an FFU (fan filter unit, not shown) as ablower unit delivering clean air from an upper portion of the partitionwall into an interior of the partition wall (corresponding to aninterior of the processing chamber 4), and an exhaust device (not shown)expelling gas inside the processing chamber 4 from a lower portion ofthe partition wall. A down flow (downward flow) is formed inside theprocessing chamber 4 by the FFU and the exhaust device.

As shown in FIG. 2, the spin chuck 5 includes a rotary table 107rotatable around a rotational axis A1 aligned with a vertical direction.A rotational shaft 108 is coupled via a boss 109 to a lower surface of arotation center of the rotary table 107. The rotational shaft 108 is ahollow shaft, extends along the vertical direction, and is arranged toreceive a driving force from a rotation driving unit 103 to rotatearound the rotational axis A1. The rotation driving unit 103 may, forexample, be an electric motor having the rotational shaft 108 as a driveshaft.

As shown in FIG. 2, the spin chuck 5 further includes a plurality (six,in the present preferred embodiment) of movable pins 110 that areprovided across substantially equal intervals along a circumferentialdirection at a peripheral edge portion of an upper surface of the rotarytable 107. The respective movable pins 110 are arranged to hold thesubstrate W horizontally at an upper substrate holding height across afixed interval from the rotary table 107 that has a substantiallyhorizontal upper surface. That is, the holding pins included in the spinchuck 5 are all movable pins 110. The rotary table 107 is formed to adisk shape along a horizontal plane and is coupled to the boss 109coupled to the rotational shaft 108.

As shown in FIG. 3, the respective movable pins 110 are disposed atequal intervals along the circumferential direction at the peripheraledge portion of the upper surface of the rotary table 107. With the sixmovable pins 110, each set of three movable pins 110 that are notmutually adjacent is configured as a single group with which magneticpole directions of corresponding driving permanent magnets 156A or 156Bare the same. In other words, the six movable pins 110 include threemovable pins 110 included in a first movable pin group 111 and threemovable pins 110 included in a second movable pin group 112. Themagnetic pole direction of each of the first driving permanent magnets156A, corresponding to the three movable pins 110 included in the firstmovable pin group 111, and the magnetic pole direction of each of thesecond driving permanent magnets 156B, corresponding to the threemovable pins 110 included in the second movable pin group 112, differmutually with respect to a direction orthogonal to a rotational axis A3.The movable pins 110 included in the first movable pin group 111 and themovable pins 110 included in the second movable pin group 112 aredisposed alternately with respect to the circumferential direction ofthe rotary table 107. In regard to the first movable pin group 111, thethree movable pins 110 are disposed at equal intervals (120° intervals).Also, in regard to the second movable pin group 112, the three movablepins 110 are disposed at equal intervals (120° intervals).

Each movable pin 110 includes a lower shaft portion 151, coupled to therotary table 107, and an upper shaft portion (support portion) 152,formed integral to an upper end of the lower shaft portion 151, and thelower shaft portion 151 and the upper shaft portion 152 are respectivelyformed to circular columnar shapes. The upper shaft portion 152 isarranged to be eccentric from a central axis of the lower shaft portion151. A front surface connecting between the upper end of the lower shaftportion 151 and a lower end of the upper shaft portion 152 forms atapered surface 153 descending from the upper shaft portion 152 to aperipheral surface of the lower shaft portion 151.

As shown in FIG. 7, each movable pin 110 is coupled to the rotary table107 so that the lower shaft portion 151 is rotatable around therotational axis A3 coaxial to a central axis thereof. More specifically,a support shaft 155, supported via a bearing 154 with respect to therotary table 107, is provided at a lower end portion of the lower shaftportion 151. A magnet holding member 157, holding a driving permanentmagnet (first or second driving magnet) 156A or 156B, is coupled to alower end of the support shaft 155. The driving permanent magnet 156A or156B is, for example, disposed with the magnetic pole direction directedin a direction orthogonal to the rotational axis A3 of the movable pin110. The first driving permanent magnets 156A are driving permanentmagnets corresponding to the movable pins 110 included in the firstmovable pin group 111. The second driving permanent magnets 156B aredriving permanent magnets corresponding to the movable pins 110 includedin the second movable pin group 112. The first driving permanent magnets156A and the second driving permanent magnets 156B are arranged to havemutually oppositely directed but equal magnetic pole directions withrespect to the direction orthogonal to the rotational axis A3 (directionorthogonal to an axis aligned with the rotational axis) in a state wherean external force is not applied to the movable pins 110 correspondingto the driving permanent magnets 156A and 156B. The first drivingpermanent magnets 156A and the second driving permanent magnets 156B aredisposed alternately with respect to the circumferential direction ofthe rotary table 107.

One of the features of the present preferred embodiment resides in thata first magnetic-force generating magnet 125 and a second magnetic-forcegenerating magnet 126 are provided below the rotary table 107.

As shown in FIG. 2, the polar direction of the first magnetic-forcegenerating magnet 125 and the polar direction of the secondmagnetic-force generating magnet 126 are both followed in the up-downdirection, and yet are opposite in direction to each other. If the uppersurface of the first magnetic-force generating magnet 125 is, forexample, the N pole, the upper surface of the second magnetic-forcegenerating magnet 126 is the S pole that is opposite in polaritythereto.

In the present preferred embodiment, three first magnetic-forcegenerating magnets 125 and three second magnetic-force generatingmagnets 126 are provided (which are identical in number with the movablepins 110 included in the movable pin groups 111 and 112). The threefirst driving permanent magnets 156A and the three second drivingpermanent magnets 156B are alternately disposed with respect to thecircumferential direction of the rotary table 107 in a plan view.

The three first magnetic-force generating magnets 125 form a circulararc that centers on the rotational axis A1, and are spaced out atmutually common height positions and in the circumferential direction ofthe rotary table 107. The three first magnetic-force generating magnets125 have mutually identical specifications, and the length (angle) inthe circumferential direction of each of the first magnetic-forcegenerating magnets 125 is about 60°. The three first magnetic-forcegenerating magnets 125 are evenly spaced out in the circumferentialdirection on the circumference that is coaxial with the rotational axisA1. Each of the first magnetic-force generating magnets 125 is disposedalong a plane (horizontal plane) perpendicular to the rotational axisA1.

The three second magnetic-force generating magnets 126 form a circulararc that centers on the rotational axis A1, and are spaced out atmutually common height positions and in the circumferential direction ofthe rotary table 107. The three second magnetic-force generating magnets126 have mutually identical specifications, and the length (angle) inthe circumferential direction of each of the second magnetic-forcegenerating magnets 126 is about 60°. The three second magnetic-forcegenerating magnets 126 are evenly spaced out in the circumferentialdirection on the circumference that is coaxial with the rotational axisA1. Each of the second magnetic-force generating magnets 126 is disposedalong a plane (horizontal plane) perpendicular to the rotational axisA1.

A first up-and-down unit (magnet moving unit) 127 that raises and lowersthe plurality of first magnetic-force generating magnets 125 and theplurality of second magnetic-force generating magnets 126 together isjoined to the first magnetic-force generating magnet 125 and to thesecond magnetic-force generating magnet 126. The first up-and-down unit127 is arranged to include, for example, a cylinder disposed so as to beextensible and contractible in the up-down direction, and is supportedby this cylinder. The first up-and-down unit 127 may be arranged to usean electric motor.

The first magnetic-force generating magnet 125 is a magnet thatgenerates an attractive magnetic force or a repulsive magnetic force (inthe present preferred embodiment, an attractive magnetic force ismentioned as an example of “an attractive magnetic force or a repulsivemagnetic force.” Therefore, “an attractive magnetic force or a repulsivemagnetic force” will be hereinafter described as “an attractive magneticforce.”) between the first driving permanent magnet 156A and the firstmagnetic-force generating magnet 125 and that urges the upper shaftportion 152 of the movable pin 110 included in the first movable pingroup 111 to an open position by the attractive magnetic force. In astate in which the first magnetic-force generating magnet 125 isdisposed at an upper position (a first position, which is shown by thesolid line in FIG. 10) slightly lower than the first driving permanentmagnet 156A, a slight attractive magnetic force acts between the firstmagnetic-force generating magnet 125 and the first driving permanentmagnet 156A when the first magnetic-force generating magnet 125 and thefirst driving permanent magnet 156A coincide with each other withrespect to their rotational directions.

On the other hand, in a state in which the first magnetic-forcegenerating magnet 125 is disposed at a lower position (a secondposition, which is shown by the broken line in FIG. 13) lower than theupper position, a magnetic force is not generated between the firstmagnetic-force generating magnet 125 and the first driving permanentmagnet 156A when the first magnetic-force generating magnet 125 and thefirst driving permanent magnet 156A coincide with each other withrespect to their rotational directions.

The second magnetic-force generating magnet 126 is a magnet thatgenerates an attractive magnetic force or a repulsive magnetic force (inthe present preferred embodiment, an attractive magnetic force ismentioned as an example of “an attractive magnetic force or a repulsivemagnetic force.” Therefore, “an attractive magnetic force or a repulsivemagnetic force” will be hereinafter described as “an attractive magneticforce.”) between the second driving permanent magnet 156B and the secondmagnetic-force generating magnet 126 and that urges the upper shaftportion 152 of the movable pin 110 included in the second movable pingroup 112 to an open position by the attractive magnetic force. In astate in which the second magnetic-force generating magnet 126 isdisposed at an upper position (a first position, which is shown by thesolid line in FIG. 10) slightly lower than the second driving permanentmagnet 156B, a slight attractive magnetic force acts between the secondmagnetic-force generating magnet 126 and the second driving permanentmagnet 156B when the second magnetic-force generating magnet 126 and thesecond driving permanent magnet 156B coincide with each other withrespect to their rotational directions.

On the other hand, in a state in which the second magnetic-forcegenerating magnet 126 is disposed at a lower position (a secondposition, which is shown by the broken line in FIG. 13) lower than theupper position, a magnetic force is not generated between the secondmagnetic-force generating magnet 126 and the second driving permanentmagnet 156B when the second magnetic-force generating magnet 126 and thesecond driving permanent magnet 156B coincide with each other withrespect to their rotational directions.

In the present preferred embodiment, the first magnetic-force generatingmagnet 125, the second magnetic-force generating magnet 126, the firstup-and-down unit 127, the rotating/driving unit 103, and the controller3 are included in the pressing-force changing unit.

As shown in FIG. 2, the spin chuck 5 further includes a protective disk115 disposed between the upper surface of the rotary table 107 and theheight of substrate holding by the movable pins 110. The protective disk115 is coupled to the rotary table 107 in a manner enabling up/downmovement, and is capable of moving between a lower position close to theupper surface of the rotary table 107 and an approach positionapproaching, across a minute interval, the lower surface of thesubstrate W held higher than the lower position by the movable pins 110.The protective disk 115 is a disk-shaped member having a size ofslightly larger diameter than the substrate W and has notches 116 formedtherein to avoid the movable pins 110 at positions corresponding to themovable pins 110.

The rotational shaft 108 is a hollow shaft and has an inert gas supplypipe 170 inserted through its interior. An inert gas supply passage 172,guiding an inert gas, as an example of a protective gas, from an inertgas supply source, is coupled to a lower end of the inert gas supplypipe 170. An inert gas, such as CDA (clean dry air) or nitrogen gas,etc., can be cited as an example of the inert gas guided by the inertgas supply passage 172. An inert gas valve 173 and an inert gas flowcontrol valve 174 are interposed in the middle of the inert gas supplypassage 172. The inert gas valve 173 opens and closes the inert gassupply passage 172. By opening the inert gas valve 173, the inert gas isdelivered into the inert gas supply pipe 170. The inert gas is suppliedto a space between the protective disk 115 and the lower surface of thesubstrate W by the arrangement to be described below. The protective gassupplying unit 12 is thus arranged from the inert gas supply pipe 170,the inert gas supply passage 172, the inert gas valve 173, etc.

The protective disk 115 is a substantially disk-shaped member having asize approximately equal to that of the substrate W. At a peripheraledge portion of the protective disk 115, the notches 116 are formed atpositions corresponding to the movable pins 110 so as to border themovable pins 110 while securing fixed intervals from outer peripheralsurfaces of the movable pins 110. A circular opening, corresponding tothe boss 109, is formed in a central region of the protective disk 115.

As shown in FIG. 3 and FIG. 5, guide shafts 117, extending in thevertical direction parallel to the rotational axis A1, are coupled to alower surface of the protective disk 115 at positions further away fromthe rotational axis A1 than the boss 109. In the present preferredembodiment, the guide shafts 117 are disposed at three locations atequal intervals in a circumferential direction of the protective disk115. More specifically, as viewed from the rotational axis A1, the threeguide shafts 117 are respectively disposed at angular positionscorresponding to every other movable pin 110. The guide shafts 117 arecoupled to linear bearings 118 provided at corresponding locations ofthe rotary table 107 and are capable of moving in the verticaldirection, that is, the direction parallel to the rotational axis A1,while being guided by the linear bearings 118. The guide shafts 117 andthe linear bearings 118 thus constitute guiding units 119 that guide theprotective disk 115 along the up/down direction parallel to therotational axis A1.

The guide shafts 117 penetrate through the linear bearings 118 andinclude outwardly projecting flanges 120 at lower ends thereof. Bycontacting of the flanges 120 with the lower ends of the linear bearings118, upward movement of the guide shafts 117, that is, upward movementof the protective disk 115 is restricted. That is, the flanges 120 arerestricting members that restrict the upward movement of the protectivedisk 115.

Magnet holding members 161 that hold the first levitating magnets 160are fixed to the lower surface of the protective disk 115 at positionsfurther outward and further away from the rotational axis A1 than theguide shafts 117 and further inward and closer to the rotational axis A1than the movable pins 110. In the present preferred embodiment, thefirst levitating magnets 160 are held in the magnet holding members 161with magnetic pole directions being directed in the up/down direction.For example, the first levitating magnets 160 may be fixed to the magnetholding members 161 so as to have the S poles at the lower sides andhave the N poles at the upper sides. In the present preferredembodiment, the magnet holding members 161 are provided at six locationsat equal intervals in the circumferential direction. More specifically,as viewed from the rotational axis A1, each magnet holding member 161 isdisposed at an angular position corresponding to being between (in themiddle in the present preferred embodiment) mutually adjacent movablepins 110. Further, the three guide shafts 117 are respectively disposedin every other angular region (at a central position of every otherangular region in the present preferred embodiment) among six angularregions that are divided (divided equally in the present preferredembodiment) by the six magnet holding members 161 as viewed from therotational axis A1.

As shown in FIG. 4, penetrating holes 162 are formed at six locations ofthe rotary table 107 corresponding to the six magnet holding members161. The respective penetrating holes 162 are formed to enable thecorresponding magnet holding members 161 to be respectively insertedthrough in the vertical direction parallel to the rotational axis A1.When the protective disk 115 is at the lower position, the magnetholding members 161 are inserted through the penetrating holes 162 andproject lower than the lower surface of the rotary table 107 and thefirst levitating magnets 160 are positioned lower than the lower surfaceof the rotary table 107.

A second levitating magnet 129 arranged to levitate the protective disk115 is provided below the rotary table 107. The second levitating magnet129 is formed to a circular annular shape coaxial to the rotational axisA1 and is disposed along a plane (horizontal plane) orthogonal to therotational axis A1. The second levitating magnet 129 is disposed at aposition closer to the rotational axis A1 than the first and secondopening permanent magnets 125 and 127. That is, it is positioned furtherto an inner diameter side than the first and second opening permanentmagnets 125 and 127 in plan view. Also, the second levitating magnet 129is disposed at a position lower than the first levitating magnets 160.In the present preferred embodiment, a magnetic pole direction of thesecond levitating magnet 129 is aligned with a horizontal direction,that is, a rotation radial direction of the rotary table 107. When thefirst levitating magnets 160 have the S poles at the lower surfaces, thesecond levitating magnet 129 is arranged to have the same magnetic pole,that is, the S pole in a ring shape at the inner side in the rotationradial direction.

A third elevating/lowering unit (third relative movement unit) 130 thatelevates and lowers the second levitating magnet 129 is coupled to thesecond levitating magnet 129. The third elevating/lowering unit 130 isof an arrangement that includes, for example, a cylinder arranged to becapable of extending and contracting in the up/down direction and issupported by the cylinder. Also, the third elevating/lowering unit 130may be arranged using an electric motor.

When the second levitating magnet 129 is at an upper position (see FIG.22B), a repulsive magnetic force acts between the second levitatingmagnet 129 and the first levitating magnets 160, and the firstlevitating magnets 160 receive an upward external force. The protectivedisk 115 thereby receives an upward force from the magnet holdingportions 161 holding the first levitating magnets 160 and is held at theapproach position approaching the lower surface of the substrate W.

In the state where the second levitating magnet 129 is disposed at alower position (see FIG. 19A) separated downward from the upperposition, the repulsive magnetic force between the second levitatingmagnet 129 and the first levitating magnets 160 is small and thereforethe protective disk 115 is maintained by its own weight at the lowerposition close to the upper surface of the rotary table 107.

Therefore when the second levitating magnet 129 is at the lowerposition, the protective disk 115 is at the lower position close to theupper surface of the rotary table 107 and the movable pins 110 are heldat the open position. In this state, the center robot CR that carries inand carries out the substrate W with respect to the spin chuck 5 canmake its hand H2 enter into the space between the protective disk 115and the lower surface of the substrate W.

As shown in enlarged manner in FIG. 6, the boss 109 coupled to the upperend of the rotational shaft 108 holds a bearing unit 175 arranged tosupport an upper end portion of the inert gas supply pipe 170. Thebearing unit 175 includes a spacer 177, fitted and fixed in a recess 176formed in the boss 109, a bearing 178 disposed between the spacer 177and the inert gas supply pipe 170, and a magnetic fluid bearing 179provided similarly but higher than the bearing 178 between the spacer177 and the inert gas supply pipe 170.

As shown in FIG. 5, the boss 109 integrally has a flange 181 projectingoutward along a horizontal plane and the rotary table 107 is coupled tothe flange 181. Further, the spacer 177 is fixed to the flange 181 so asto sandwich an inner peripheral edge portion of the rotary table 107,and a cover 184 is coupled to the spacer 177. The cover 184 is formedsubstantially to a disk shape, has, at its center, an opening arrangedto expose an upper end of the inert gas supply pipe 170, and has formed,in its upper surface, a recess 185 with the opening as a bottom surface.The recess 185 has a horizontal bottom surface and an inclined surface183 of inverted conical surface shape that rises obliquely upward towardthe exterior from a peripheral edge of the bottom surface. A flowstraightening member 186 is coupled to the bottom surface of the recess185. The flow straightening member 186 has a plurality (for example,four) of leg portions 187, disposed discretely around the rotationalaxis A1 at intervals along the circumferential direction, and has abottom surface 188 disposed, by the leg portions 187 at an interval fromthe bottom surface of the recess 185. An inclined surface 189constituted of an inverted conical surface is formed that risesobliquely upward toward the exterior from a peripheral edge of portionthe bottom surface 188.

As shown in FIG. 5 and FIG. 6, a flange 184 a is formed outwardly at anupper surface outer peripheral edge of the cover 184. The flange 184 ais arranged to match a step portion 115 a formed at an inner peripheraledge of the protective disk 115. That is, when the protective disk 115is at the approach position approaching the lower surface of thesubstrate W, the flange 184 a and the step portion 115 a are merged andan upper surface of the cover 184 and an upper surface of the protectivedisk 115 are positioned within the same plane to form a flat inert gasflow passage.

By such an arrangement, the inert gas flowing out from the upper end ofthe inert gas supply pipe 170 exits into a space defined by the bottomsurface 188 of the flow straightening member 186 inside the recess 185of the cover 184. The inert gas further blows out in radial directionsaway from the rotational axis A1 via a radial flow passage 182 definedby the inclined surface 183 of the recess 185 and the inclined surface189 of the flow straightening member 186. The inert gas forms a gasstream of inert gas in the space between the protective disk 115 and thelower surface of the substrate W held by the movable pins 110 and blowsoutward in rotation radial directions of the substrate W from the space.

As shown in FIG. 5, a peripheral edge portion of the upper surface ofthe protective disk 115 and a peripheral end of the protective disk 115are covered by a circular annular cover 191 of circular annular shape.The circular annular cover 191 includes a circular annular plate portion192 protruding in horizontal directions and outward in radial directionsfrom a peripheral edge portion of its upper surface, and a circularcylindrical portion 193 extending downward from a peripheral end of thecircular annular plate portion 192. An outer periphery of the circularannular plate portion 192 is disposed further outward than a peripheralend of the rotary table 107. The circular annular plate portion 192 andthe circular cylindrical portion 193 are formed integrally using, forexample, a resin material having chemical resistance. Notches 194,arranged to avoid the movable pins 110, are formed at positions of aninner periphery of the circular annular plate portion 192 correspondingto the movable pins 110. The notches 194 are formed so as to border themovable pins 110 with fixed intervals being secured from the outerperipheral surfaces of the movable pins 110. The circular annular plateportion 192 and the circular cylindrical portion 193 are formedintegrally using, for example, a resin material having chemicalresistance.

The circular annular plate portion 192 of the circular annular cover 191has, on its upper surface, a constricting portion that constricts theflow passage of the inert gas at a peripheral edge portion of thesubstrate W held by the movable pins 110. By the constricting portion, aflow speed of the inert gas flow blowing outward from the space betweenthe circular annular cover 191 and the lower surface of the substrate Wis made high, thereby enabling reliable avoidance or suppression ofentry of the processing liquid (chemical liquid or rinse liquid) on theupper surface of the substrate W further inward than a peripheral edgeportion of the lower surface of the substrate W.

Opening/closing switching permanent magnets 121 and 122 the number ofwhich is identical with the number of the movable pins 110 (in thepresent preferred embodiment, six) are buried in the cylindrical portion193. The plurality of opening/closing switching permanent magnets 121and 122 are spaced out in the circumferential direction. Each of theopening/closing switching permanent magnets 121 and 122 is formed in arod shape, and is buried in the cylindrical portion 193 in a state ofextending in the up-down direction. The opening/closing switchingpermanent magnet includes a first opening/closing switching permanentmagnet (pressing magnet) 121 and a second opening/closing switchingpermanent magnet (pressing magnet) 122 that is reversed in polarity withthe first opening/closing switching permanent magnet 121 in the up-downdirection. The first opening/closing switching permanent magnet 121 is apermanent magnet to drive the movable pin 110 included in the firstmovable pin group 111, and the second opening/closing switchingpermanent magnet 122 is a permanent magnet to drive the movable pin 110included in the second movable pin group 112. In other words, theplurality of opening/closing switching permanent magnets 121 and 122 areevenly spaced out. The first opening/closing switching permanent magnet121 and the second opening/closing switching permanent magnet 122 arealternately disposed in the circumferential direction. In the presentpreferred embodiment, the first opening/closing switching permanentmagnet 121 has an N-pole portion 123 showing N polarity on its upper endside, and has an S-pole portion 124 showing S polarity on its lower endside.

FIG. 8 is a schematic view showing an open state of the movable pin 110included in the first movable pin group 111. FIG. 9 is a schematic viewshowing a closed state of the movable pin 110 included in the firstmovable pin group 111. FIG. 10 is a schematic view showing a state ofthe movable pin 110 included in the first movable pin group 111resulting from the up-and-down movement of the first magnetic-forcegenerating magnet 125. In FIG. 10, a state in which the firstmagnetic-force generating magnet 125 is at the upper position is shownby the solid line, and a state in which the first magnetic-forcegenerating magnet 125 is at the lower position is shown by the brokenline.

FIG. 11 is a schematic view showing an open state of the movable pin 110included in the second movable pin group 112. FIG. 12 is a schematicview showing a closed state of the movable pin 110 included in thesecond movable pin group 112. FIG. 13 is a schematic view showing astate of the movable pin 110 included in the second movable pin group112 resulting from the up-and-down movement of the second magnetic-forcegenerating magnet 126. In FIG. 13, a state in which the secondmagnetic-force generating magnet 126 is at the upper position is shownby the solid line, and a state in which the second magnetic-forcegenerating magnet 126 is at the lower position is shown by the brokenline.

As shown in FIG. 8 and FIG. 9, the first opening/closing switchingpermanent magnet 121 is disposed so that the N-pole portion 123 on theupper end side approaches the first driving permanent magnet 156A whenthe protective disk 115 is at the approach position and so that theS-pole portion 124 on the lower end side approaches the first drivingpermanent magnet 156A when the protective disk 115 is at the lowerposition.

As shown in FIG. 11 and FIG. 12, the second opening/closing switchingpermanent magnet 122 is disposed so that the S-pole portion 124 on theupper end side approaches the second driving permanent magnet 156B whenthe protective disk 115 is at the approach position and so that theN-pole portion 123 on the lower end side approaches the second drivingpermanent magnet 156B when the protective disk 115 is at the lowerposition.

In the first preferred embodiment, the protective disk 115 is held atthe approach position at which the protective disk 115 has approachedthe lower surface of the substrate W by means of the operation of arepulsive magnetic force generated between the second disk-floatingmagnet 129 and the first disk-floating magnet 160 when the seconddisk-floating magnet 129 is at the upper position (see FIG. 9 and FIG.12) as described above. On the other hand, when the second disk-floatingmagnet 129 is at the lower position (see FIG. 8 and FIG. 11) downwardlyapart from the upper position, the repulsive magnetic force between thesecond disk-floating magnet 129 and the first disk-floating magnet 160is small, and therefore the protective disk 115 is held at the lowerposition closer to the upper surface of the rotary table 107 because ofits own weight.

When the protective disk 115 is at the lower position, the N-poleportion 123 on the upper end side of the first opening/closing switchingpermanent magnet 121 approaches the first driving permanent magnet 156Aas shown in FIG. 8. In this state, only a magnetic force given from theN-pole portion 123 of the first opening/closing switching permanentmagnet 121 acts on the first driving permanent magnet 156A, and amagnetic force given from the S-pole portion 124 thereof does not act onthe first driving permanent magnet 156A. Therefore, the first drivingpermanent magnet 156A is disposed to assume a posture in which the Npole is pointed inwardly in the radial direction of the rotary table 107and in which the S pole is pointed outwardly in the radial direction ofthe rotary table 107 by receiving the magnetic force from the firstopening/closing switching permanent magnet 121 as shown in FIG. 8. Inthis state, the upper shaft portion 152 of the movable pin 110 includedin the first movable pin group 111 is placed at the open position faraway from the rotational axis A1 (see FIG. 2).

Additionally, in this state (in which the protective disk 115 is at thelower position), the S-pole portion 124 on the upper end side of thesecond opening/closing switching permanent magnet 122 approaches thesecond driving permanent magnet 156B as shown in FIG. 11. In this state,only a magnetic force given from the S-pole portion 124 of the secondopening/closing switching permanent magnet 122 acts on the seconddriving permanent magnet 156B, and a magnetic force given from theN-pole portion 123 thereof does not act on the second driving permanentmagnet 156B. Therefore, the second driving permanent magnet 156B isdisposed to assume a posture in which the S pole is pointed inwardly inthe radial direction of the rotary table 107 and in which the N pole ispointed outwardly in the radial direction of the rotary table 107 byreceiving the magnetic force from the second opening/closing switchingpermanent magnet 122 as shown in FIG. 11. In this state, the upper shaftportion 152 of the movable pin 110 included in the second movable pingroup 112 is placed at the open position far away from the rotationalaxis A1 (see FIG. 2).

The second disk-floating magnet 129 (see FIG. 2) is raised from thestate shown in FIG. 8 and FIG. 11, and the protective disk 115 isfloated. The first and second opening/closing switching permanentmagnets 121 and 122 are also raised correspondingly with the floating ofthe protective disk 115.

In a state in which the protective disk 115 is placed at the approachposition, the S-pole portion 124 on the lower end side of the firstopening/closing switching permanent magnet 121 approaches the firstdriving permanent magnet 156A as shown in FIG. 9. In this state, only amagnetic force given from the S-pole portion 124 of the firstopening/closing switching permanent magnet 121 acts on the first drivingpermanent magnet 156A, and a magnetic force given from the N-poleportion 123 thereof does not act on the first driving permanent magnet156A. Therefore, the first driving permanent magnet 156A assumes aposture in which the S pole is pointed inwardly in the radial directionof the rotary table 107 and in which the N pole is pointed outwardly inthe radial direction of the rotary table 107 by receiving the magneticforce from the first opening/closing switching permanent magnet 121 asshown in FIG. 9. In this state, the upper shaft portion 152 of themovable pin 110 included in the first movable pin group 111 moves to thecontact position closer to the rotational axis A1 than the openposition. As a result, the movable pin 110 included in the first movablepin group 111 is urged toward the contact position.

In this state, when the first magnetic-force generating magnet 125 isplaced at the upper position (first position) as shown by the solid linein FIG. 10, a slight magnetic force (e.g., attractive magnetic force)acts between the first magnetic-force generating magnet 125 and thefirst driving permanent magnet 156A in a state in which the firstmagnetic-force generating magnet 125 and the first driving permanentmagnet 156A coincide with each other with respect to their rotationaldirections. As described above, the magnetic force (e.g., attractivemagnetic force) generated between the first magnetic-force generatingmagnet 125 and the first driving permanent magnet 156A is capable ofurging the upper shaft portion 152 of the movable pin 110 included inthe first movable pin group 111 toward the open position. In thismagnetic force (e.g., attractive magnetic force), the magnitude(magnetic flux density) of a magnetic field between the firstmagnetic-force generating magnet 125 and the first driving permanentmagnet 156A is, for example, about several tens of milliteslas (mT), andis remarkably smaller than the magnitude (magnetic flux density: aboutseveral hundred milliteslas (mT)) of a magnetic field between the firstdriving permanent magnet 156A and the S-pole portion 124 of the firstopening/closing switching permanent magnet 121.

On the other hand, when the first magnetic-force generating magnet 125is placed at the lower position as shown by the broken line in FIG. 10,a magnetic force is not generated between the first magnetic-forcegenerating magnet 125 and the first driving permanent magnet 156A evenwhen the first magnetic-force generating magnet 125 and the firstdriving permanent magnet 156A coincide with each other with respect totheir rotational directions.

Additionally, in this state (in which the protective disk 115 is placedat the approach position), the N-pole portion 123 on the lower end sideof the second opening/closing switching permanent magnet 122 approachesthe second driving permanent magnet 156B as shown in FIG. 12. In thisstate, only a magnetic force given from the N-pole portion 123 of thesecond opening/closing switching permanent magnet 122 acts on the seconddriving permanent magnet 156B, and a magnetic force given from theS-pole portion 124 thereof does not act on the second driving permanentmagnet 156B. Therefore, the second driving permanent magnet 156B assumesa posture in which the N pole is pointed inwardly in the radialdirection of the rotary table 107 and in which the S pole is pointedoutwardly in the radial direction of the rotary table 107 by receivingthe magnetic force from the second opening/closing switching permanentmagnet 122 as shown in FIG. 12. In this state, the upper shaft portion152 of the movable pin 110 included in the second movable pin group 112moves to the contact position closer to the rotational axis A1 than theopen position. As a result, the movable pin 110 included in the secondmovable pin group 112 is urged toward the contact position.

In this state, when the second magnetic-force generating magnet 126 isplaced at the upper position (first position) as shown by the solid linein FIG. 13, a slight magnetic force (e.g., attractive magnetic force)acts between the second magnetic-force generating magnet 126 and thesecond driving permanent magnet 156B in a state in which the secondmagnetic-force generating magnet 126 and the second driving permanentmagnet 156B coincide with each other with respect to their rotationaldirections. As described above, the magnetic force (in the presentpreferred embodiment, attractive magnetic force) generated between thesecond magnetic-force generating magnet 126 and the second drivingpermanent magnet 156B is capable of urging the upper shaft portion 152of the movable pin 110 included in the second movable pin group 112toward the open position. In this magnetic force (e.g., attractivemagnetic force), the magnitude (magnetic flux density) of a magneticfield between the second magnetic-force generating magnet 126 and thesecond driving permanent magnet 156B is, for example, about several tensof milliteslas (mT), and is remarkably smaller than the magnitude(magnetic flux density: about several hundred milliteslas (mT)) of amagnetic field between the second driving permanent magnet 156B and theN-pole portion 123 of the second opening/closing switching permanentmagnet 122.

On the other hand, when the second magnetic-force generating magnet 126is placed at the lower position as shown by the broken line in FIG. 13,a magnetic force is not generated between the second magnetic-forcegenerating magnet 126 and the second driving permanent magnet 156B evenwhen the second magnetic-force generating magnet 126 and the seconddriving permanent magnet 156B coincide with each other with respect totheir rotational directions.

As shown in FIG. 2, the chemical liquid supplying unit 7 includes achemical liquid nozzle 6 that discharges the FOM (chemical liquid)toward the upper surface of the substrate W, a nozzle arm 21, at a tipportion of which is mounted the chemical nozzle 6, and a nozzle movingunit 22 that moves the nozzle arm 21 to move the chemical liquid nozzle6.

The chemical liquid nozzle 6 is, for example, a straight nozzle thatdischarges the chemical liquid in a continuous flow state and is mountedto the nozzle arm 21, for example, in a perpendicular orientation ofdischarging the chemical liquid in a direction perpendicular to theupper surface of the substrate W. The nozzle arm 21 extends in ahorizontal direction and is arranged to be pivotable around a prescribedswinging axis (not shown) extending in the vertical direction at aperiphery of the spin chuck 5.

The chemical liquid supplying unit 7 includes a chemical liquid piping14 that guides the chemical liquid to the chemical liquid nozzle 6 and achemical liquid valve 15 that opens and closes the chemical liquidpiping 14. When the chemical liquid valve 15 is opened, the chemicalliquid from a chemical liquid supply source is supplied to the chemicalliquid nozzle 6 from the chemical liquid piping 14. The chemical liquidis thereby discharged from the chemical liquid nozzle 6.

The chemical liquid to be supplied to the chemical liquid piping 14 is aliquid including at least one among, for example, sulfuric acid, aceticacid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueousammonia, hydrogen peroxide water, organic acid (e.g., citric acid,oxalic acid), organic alkali (e.g., TMAH: tetramethylammoniumhydroxide), organic solvent (e.g., IPA: isopropyl alcohol), surfactant,and corrosion inhibitor.

The nozzle moving unit 22 turns the nozzle arm 21 around the swingingaxis to move the chemical liquid nozzle 6 horizontally along a locuspassing through an upper surface central portion of the substrate W inplan view. The nozzle moving unit 22 moves the chemical liquid nozzle 6horizontally between a processing position, at which the chemical liquiddischarged from the chemical liquid nozzle 6 lands on the upper surfaceof the substrate W, and a home position, at which the chemical liquidnozzle 6 is set at a periphery of the spin chuck 5 in plan view.Further, the nozzle moving unit 22 moves the chemical liquid nozzle 6horizontally between a central position, at which the chemical liquiddischarged from the chemical liquid nozzle 6 lands on the upper surfacecentral portion of the substrate W, and a peripheral edge portion, atwhich the chemical liquid discharged from the chemical liquid nozzle 6lands on an upper surface peripheral edge portion of the substrate W.The central position and the peripheral edge position are bothprocessing positions.

The chemical liquid nozzle 6 may be a fixed nozzle that is disposedfixedly with its discharge port directed toward a prescribed position(for example, the central portion) of the upper surface of the substrateW.

As shown in FIG. 2, the water supplying unit 8 includes a water nozzle41. The water nozzle 41 is, for example, a straight nozzle thatdischarges liquid in a continuous flow state and is disposed fixedlyabove the spin chuck 5 with its discharge port directed toward thecentral portion of the upper surface of the substrate W. A water piping42, to which water from a water supply source is supplied, is connectedto the water nozzle 41. A water valve 43, arranged to switch betweensupplying and stopping the supplying of water from the water nozzle 41,is interposed at an intermediate portion of the water piping 42. Whenthe water valve 43 is opened, the continuous flow of water supplied fromthe water piping 42 to the water nozzle 41 is discharged from thedischarge port set at a lower end of the water nozzle 41. Also, when thewater valve 43 is closed, the supplying of water from the water piping42 to the water nozzle 41 is stopped. The water is, for example,deionized water (DIW). The water is not restricted to DIW and may be anyof carbonated water, electrolyzed ion water, hydrogen water, ozonewater, and aqueous hydrochloric acid solution of dilute concentration(for example of approximately 10 ppm to 100 ppm).

The water nozzle 41 does not need to be disposed fixedly with respect tothe spin chuck 5 and, for example, a form of a so-called scan nozzle,which is mounted on an arm swingable within a horizontal plane above thespin chuck 5 and with which a landing position of water on the uppersurface of the substrate W is scanned by the swinging of the arm, may beadopted instead.

With reference to FIG. 7, the movable pin 110 has the upper shaftportion 152 at a position that is eccentric with respect to therotational axis A2 as described above. In other words, the central axisB of the upper shaft portion 152 deviates from the rotational axis A2.Therefore, the upper shaft portion 152 is displaced by the rotation ofthe lower shaft portion 151 between an open position (at which thecentral axis B is placed) distant from the rotational axis A1 (see FIG.8 and FIG. 11 described later) and a contact position (at which thecentral axis B is placed) close to the rotational axis A1 (see FIG. 9and FIG. 12 described later). The upper shaft portion 152 of the movablepin 110 is urged toward the open position by means of an elasticpressing force of an elastic pressing member such as a spring (notshown). A predetermined gap with the peripheral end surface of thesubstrate W is formed in a state in which the movable pin 110 is placedat the open position.

FIGS. 14A, 15A, 16A, 17A, and 18A are views showing a positionalrelationship between the first and second driving permanent magnets156A, 156B and the first and second magnetic-force generating magnets125,126 when the first and second magnetic-force generating magnets 125and 126 are each disposed at the upper position and when the rotarytable 107 is rotated. FIGS. 14B, 15B, 16B, 17B, and 18B are viewsshowing the movement of the substrate W with respect to the rotary table107 when the first and second magnetic-force generating magnets 125 and126 are each disposed at the upper position and when the rotary table107 is rotated.

A group of FIGS. 14A and 14B, a group of FIGS. 15A and 15B, a group ofFIGS. 16A and 16B, a group of FIGS. 17A and 17B, and a group of FIGS.18A and 18B have mutually common rotational direction positions,respectively. Additionally, in FIGS. 14A to 18B, alphabetical lettersare respectively assigned to the rears of reference signs “110”correspondingly to each movable pin in order to discriminate the sixmovable pins 110 from each other. In this respect, the same applies toFIG. 25. A state in which the rotational phase of the rotary table 107has proceeded from the state of FIGS. 14A and 14B by about 30° in therotational direction Dr1 is shown in FIGS. 15A and 15B. A state in whichthe rotational phase of the rotary table 107 has further proceeded fromthe state of FIGS. 15A and 15B by about 30° in the rotational directionDr1 is shown in FIGS. 16A and 16B. A state in which the rotational phaseof the rotary table 107 has further proceeded from the state of FIGS.16A and 16B by about 30° in the rotational direction Dr1 is shown inFIGS. 17A and 17B. A state in which the rotational phase of the rotarytable 107 has further proceeded from the state of FIGS. 17A and 17B byabout 30° in the rotational direction Dr1 is shown in FIGS. 18A and 18B.

In a state in which the first magnetic-force generating magnet 125 isplaced at the upper position, a magnetic force (e.g., attractivemagnetic force) directed to urge the upper shaft portion 152 of themovable pin 110 included in the first movable pin group 111 toward theopen position is generated between the first driving permanent magnet156A and the first magnetic-force generating magnet 125 so as to have asmaller magnitude than a magnetic force (e.g., attractive magneticforce) generated between the first driving permanent magnet 156A and thefirst opening/closing switching permanent magnet 121.

In a state in which the second magnetic-force generating magnet 126 isplaced at the upper position, a magnetic force (e.g., attractivemagnetic force) directed to urge the upper shaft portion 152 of themovable pin 110 included in the second movable pin group 112 toward theopen position is generated between the second driving permanent magnet156B and the second magnetic-force generating magnet 126 so as to have asmaller magnitude than a magnetic force (e.g., attractive magneticforce) generated between the second driving permanent magnet 156B andthe second opening/closing switching permanent magnet 122.

During rotation processing (a chemical liquid supply step (S6) and arinse step (S7)) described later, in a state in which the substrate W isgripped by the plurality of support pins (movable pins 110) (i.e., in astate in which the upper shaft portion 152 of the movable pin 110 is atthe contact position and is pressing the peripheral edge of thesubstrate W), the rotating/driving unit 103 rotates the rotary table 107at a speed of the liquid processing speed (e.g., about 500 rpm) in therotational direction Dr1. As a result, the substrate W is rotated aroundthe rotational axis A1, and a centrifugal force generated by therotation acts on the peripheral edge of the substrate W.

In rotation processing (the chemical liquid supply step (S6) and therinse step (S7)), the distance between the first driving permanentmagnet 156A and the first magnetic-force generating magnet 125 changesin accordance with the rotational angle position of the substrate W. Inother words, the magnitude of a magnetic force in an opposite directionthat acts on each of the first driving permanent magnets 156A changes inaccordance with the rotational angle position of the substrate W. Thismakes it possible to change a magnetic force (e.g., attractive magneticforce) generated between each of the first the driving permanent magnets156A and the first magnetic-force generating magnet 125 in response torotation of the substrate W. The magnitude of a magnetic force (e.g.,attractive magnetic force) generated between the first driving permanentmagnet 156A and the first magnetic-force generating magnet 125 issmaller than that of a magnetic force (e.g., attractive magnetic force)generated between the first driving permanent magnet 156A and the firstopening/closing switching permanent magnet 121. Therefore, it ispossible to change the magnitude of a pressing force against theperipheral edge of the substrate W applied by the upper shaft portion152 of the movable pin 110 while keeping its magnitude higher than zeroin response to rotation of the rotary table 107.

Additionally, in rotation processing (the chemical liquid supply step(S6) and the rinse step (S7)), the distance between the second drivingpermanent magnet 156B and the second magnetic-force generating magnet126 changes in accordance with the rotational angle position of thesubstrate W. In other words, the magnitude of a magnetic force in anopposite direction that acts on each of the second driving permanentmagnets 156B changes in accordance with the rotational angle position ofthe substrate W. This makes it possible to change a magnetic force(e.g., attractive magnetic force) generated between each of the seconddriving permanent magnets 156B and the second magnetic-force generatingmagnet 126 in response to rotation of the substrate W. The magnitude ofa magnetic force (e.g., attractive magnetic force) generated between thesecond driving permanent magnet 156B and the second magnetic-forcegenerating magnet 126 is smaller than that of a magnetic force (e.g.,attractive magnetic force) generated between the second drivingpermanent magnet 156B and the second opening/closing switching permanentmagnet 122. Therefore, it is possible to change the magnitude of apressing force against the peripheral edge of the substrate W applied bythe upper shaft portion 152 of the movable pin 110 while keeping itsmagnitude higher than zero in response to rotation of the rotary table107.

In other words, in rotation processing (the chemical liquid supply step(S6) and the rinse step (S7)), it is possible to change a pressing forceapplied from the upper shaft portion 152 of each movable pin 110 whileallowing a centrifugal force to act on the peripheral edge of thesubstrate W. As a result, the substrate W being in a rotational statebecomes eccentric. Accordingly, as shown in FIGS. 14B, 15B, 16B, 17B,and 18B, the eccentric direction DE of the substrate W changes inaccordance with the rotational angle position of the substrate W beingin a rotational state.

Additionally, in rotation processing (the chemical liquid supply step(S6) and the rinse step (S7)), a processing liquid (chemical liquid orwater) is supplied to the upper surface of the substrate W in parallelto rotation of the rotary table 107 with respect to the magnetic-forcegenerating magnet as described later. A load that acts on the substrateW is increased by the supply of the processing liquid (chemical liquidor water) to the upper surface of the substrate W. When the substrate Wis in a rotational state, the increase of the load acts on the substrateW that is in contact with and that is supported by the plurality ofsupport pins (movable pins 110) as rotational resistance that obstructsthe turning of the substrate W. A centrifugal force generated by therotation of the substrate W also acts on the peripheral edge of thesubstrate W. These make it possible to increase the rotational amount ofthe substrate W with respect to the rotary table 107. Therefore, it ispossible to more effectively displace the contact-support position inthe peripheral edge of the substrate W in the circumferential direction.

Therefore, in rotation processing (the chemical liquid supply step (S6)and the rinse step (S7)), the substrate W being in a rotational statebecomes eccentric, and the eccentric direction DE of the substrate Wchanges in accordance with the rotational angle position of thesubstrate W being in a rotational state, and a force that obstructs theturning of the substrate W acts on the substrate W. Therefore, thesubstrate W being in a rotational state relatively turns in a turningdirection Dr2 having a circumferential direction opposite to therotational direction Dr1 with respect to the rotary table 107 and thesupport pin (movable pin 110). As a result, in the chemical liquidsupply step (S6), it is possible to displace the contact-supportposition in the peripheral edge of the substrate W supported by thesupport pin (movable pin 110) in the circumferential direction(rotational direction Dr2) while allowing the plurality of support pins(movable pins 110) to come into contact with and support the peripheraledge of the substrate W.

Additionally, the first magnetic-force generating magnet 125 and thesecond magnetic-force generating magnet 126 are alternately disposed inthe circumferential direction, and therefore the magnetic pole of amagnetic field given to the first and second driving permanent magnets156A and 156B changes in response to rotation of the rotary table 107(the magnetic field is nonuniform). In this case, it is possible toabruptly change a magnetic force generated between the first and seconddriving permanent magnets 156A, 156B and the first and secondmagnetic-force generating magnets 125,126 in accordance with therotational angle position of the substrate W. Therefore, it is possibleto largely change a magnetic force generated between each drivingpermanent magnet 156A or 156B and the magnetic-force generating magnets125, 126 in response to rotation of the substrate W, and it is possibleto accelerate the turning of the substrate W in the turning directionDr2.

FIG. 19 is a block diagram to describe an electric configuration of amain part of the substrate processing apparatus 1.

The controller 3 is formed of, for example, a microcomputer. Thecontroller 3 has an arithmetic unit, such as a CPU, a read-only memorydevice, a storage portion, such as a hard disk drive, and aninput-output unit. A program that is executed by the arithmetic unit isstored in a storage unit.

The controller 3 controls operations of the rotating/driving unit 103,the nozzle moving unit 22, the first and second up-and-down units 127,130, etc. The controller further controls an open-close operation andsimilar operations of the chemical liquid valve 15, the water valve 43,the inert gas valve 173, the inert gas flow control valve 174, etc.

FIG. 20 is a flowchart to describe one example of processing-liquidprocessing performed by the processing unit 2. FIG. 21 is a time chartto describe the processing-liquid processing. FIGS. 22A to 22H arepictorial views to describe a processing example of theprocessing-liquid processing.

The processing-liquid processing will be described with reference toFIG. 1, FIG. 2 to FIG. 13, and FIG. 19 to FIG. 21. Reference isappropriately made to FIG. 22A to FIG. 22H.

A substrate to be processed by the processing unit 2 is a substrate W(which might be hereinafter referred to as a “not-yet-washed substrate”in some cases) that has been processed, for example, by a preprocessingdevice, such as an annealer or a film formation device. A circularsilicon substrate can be mentioned as one example of the substrate W.The processing unit 2 washes, for example, a rear surface Wb (oneprincipal plane; a device non-forming surface) that is on the oppositeside to a front surface Wa (one other principal plane; a device formingsurface) in the substrate W.

A carrier C in which a not-yet-washed substrate W is contained isconveyed from a preprocessing device to the substrate processingapparatus 1, and is placed at a load port LP. The substrate W iscontained in the carrier C in a state in which the front surface Wa ofthe substrate W is directed upwardly. The controller 3 allows theindexer robot IR to convey the substrate W from the carrier C to thereversing unit TU in a state in which the front surface Wa is directedupwardly. Thereafter, the controller 3 allows the reversing unit TU toreverse the substrate W that has been conveyed thereto (S1: substratereversal). As a result, the rear surface Wb of the substrate W isdirected upwardly. Thereafter, the controller 3 allows the hand H2 ofthe center robot CR to take the substrate W out of the reversing unit TUand to carry the substrate W into the processing unit 2 in a state inwhich the rear surface Wb is directed upwardly (step S2).

In a state in which the substrate W has not yet been carried thereinto,the chemical liquid nozzle 6 is withdrawn to the home position that isset beside the spin chuck 5. Additionally, the first and secondmagnetic-force generating magnets 125 and 126 are each disposed at thelower position.

In a state in which the substrate W has not yet been carried thereinto,the second disk-floating magnet 129 is placed at the lower position, andtherefore the second disk-floating magnet 129 is largely away from therotary table 107 downwardly, and therefore a repulsive magnetic forcethat acts between the second disk-floating magnet 129 and the firstdisk-floating magnet 160 is small. Therefore, the protective disk 115 isplaced at the lower position closer to the upper surface of the rotarytable 107. Therefore, a sufficient space that can be entered by the handH2 of the center robot CR is secured between a substrate holding heightdetermined by the movable pin 110 and the upper surface of theprotective disk 115.

Additionally, the protective disk 115 is placed at the lower position,and therefore the N-pole portion 123 on the upper end side of the firstopening/closing switching permanent magnet 121 approaches the firstdriving permanent magnet 156A, and the S-pole portion 124 on the upperend side of the second opening/closing switching permanent magnet 122approaches the second driving permanent magnet 156B. In this state, anyof three movable pins 110 included in the first movable pin group 111and any of three movable pins 110 included in the second movable pingroup 112 are placed at the open position, i.e., all of six movable pins110 are placed at the open position.

The hand H2 of the center robot CR conveys the substrate W to a spaceabove the spin chuck 5 in a state of holding the substrate W at aposition higher than the upper end of the movable pin 110. Thereafter,as shown in FIG. 22A, the hand H2 of the center robot CR descends towardthe upper surface of the rotary table 107. As a result, the substrate Wis delivered to the six movable pins 110 present at the open position.Thereafter, the hand H2 of the center robot CR recedes toward the sideof the spin chuck 5 through a space between the movable pins 110.

As shown in FIG. 22B, the controller 3 allows the second up-and-downunit 130 to raise the second disk-floating magnet 129 toward the upperposition while controlling the second up-and-down unit 130. The distancebetween these disk-floating magnets 129 and 160 becomes smaller, and,accordingly, a repulsive magnetic force that acts between these magnetsbecomes larger. The protective disk 115 floats from the upper surface ofthe rotary table 107 toward the substrate W by means of the repulsivemagnetic force (step S3). Thereafter, when the first magnetic-forcegenerating magnet 125 reaches the upper position, the protective disk115 reaches the approach position that is close to the substrate W witha slight interval between the protective disk 115 and the front surfaceWa (lower surface) of the substrate W, and the flange 120 formed at thelower end of the guide shaft 117 comes into contact with the linearbearing 118. As a result, the protective disk 115 is held at theapproach position.

In response to the rise of the protective disk 115 from the lowerposition to the approach position, the N-pole portion 123 on the upperend side of the first opening/closing switching permanent magnet 121recedes from the first driving permanent magnet 156A, and, instead, theS-pole portion 124 on the lower end side of the first opening/closingswitching permanent magnet 121 approaches the first driving permanentmagnet 156A. Additionally, in response to the rise of the protectivedisk 115 from the lower position to the approach position, the S-poleportion 124 on the upper end side of the second opening/closingswitching permanent magnet 122 recedes from the second driving permanentmagnet 156B, and, instead, the N-pole portion 123 on the lower end sideof the second opening/closing switching permanent magnet 122 approachesthe second driving permanent magnet 156B. As a result, all of themovable pins 110 are driven from the open position to the contactposition, and are held at the contact position. As a result, thesubstrate W is gripped by the six movable pins 110, and the substrate Wis held by the spin chuck 5 in a state in which its front surface Wa isdirected downwardly and in which its rear surface Wb is directedupwardly.

Thereafter, as shown in FIG. 22B, the controller 3 opens the inert gasvalve 173, and starts to supply an inert gas (step S4). The inert gassupplied as above is discharged from the upper end of the inert gassupply pipe 170, and is spouted in a radial manner centering on therotational axis A1 toward a narrow space between the protective disk 115placed at the approach position and the front surface Wa (lower surface)of the substrate W by means of operations of the rectifying member 186etc.

Thereafter, the controller 3 controls the rotating/driving unit 103 tostart to rotate the rotary table 107 (rotation step), and hence allowsthe rotating/driving unit 103 to rotate the substrate W around therotational axis A1 as shown in FIG. 22C (step S5). The rotation speed ofthe substrate W is raised to a predetermined liquid processing speed(e.g., 500 rpm within the range of 300 to 1500 rpm), and is kept at thatliquid processing speed.

After the rotation speed of the substrate W reaches the liquidprocessing speed, the controller 3 performs a chemical liquid supplystep (processing-liquid supply step; rotation processing; Step S6) ofsupplying a chemical liquid to the upper surface of the substrate W(rear surface Wb of the substrate W) as shown in FIG. 22C. In thechemical liquid supply step (S6), the controller 3 controls and allowsthe nozzle moving unit 22 to move the chemical liquid nozzle 6 from thehome position to the central position. As a result, the chemical liquidnozzle 6 is placed above a central part of the substrate W. After thechemical liquid nozzle 6 is placed above the substrate W, the controller3 allows the chemical liquid valve 15 to be opened, and, as a result, achemical liquid is discharged from the discharge port of the chemicalliquid nozzle 6, and lands on a central part of the rear surface Wb ofthe substrate W. The chemical liquid supplied to the central part of therear surface Wb of the substrate W receives a centrifugal forcegenerated by the rotation of the substrate W, and spreads radiallytoward the peripheral edge on the rear surface Wb of the substrate W.Therefore, it is possible to spread the chemical liquid on the wholearea of the rear surface Wb of the substrate W. Thus, the rear surfaceWb of the substrate W is processed by use of the chemical liquid.

In the chemical liquid supply step (T6) and the rinse step (T7)described later, an inert gas discharged from the upper end of the inertgas supply pipe 170 is spouted in a radial manner centering on therotational axis A1 toward a narrow space between the protective disk 115placed at the approach position and the front surface Wa of thesubstrate W (lower surface) by means of operations of the rectifyingmember 186 etc. This inert gas is further accelerated by a narrowingportion (orifice) provided at the peripheral edge of the annular plateportion 192 of the annular cover 191 disposed at the peripheral edge ofthe protective disk 115, and forms a high-speed spouting airflow besidethe substrate W. In the present preferred embodiment, an inert gas issupplied to the front surface Wa (lower surface) of the substrate Wwhile using the protective disk 115, and, as a result, withoutcompletely preventing a processing liquid (chemical liquid or rinseliquid) from flowing around the front surface Wa (lower surface) of thesubstrate W, the chemical liquid is allowed to daringly flow only arounda peripheral edge area of the front surface Wa (lower surface) of thesubstrate W (a fairly small range of, for example, about 1.0 mm from theperipheral end of the substrate W) so that the peripheral edge area ofthe front surface Wa undergoes chemical-liquid processing. Additionally,the amount of its flow-around is controlled with excellent accuracy bycontrolling the supply flow rate of the processing liquid to the uppersurface of the substrate W, the supply flow rate of the inert gas to thelower surface of the substrate W, the rotation speed of the substrate W,etc.

Additionally, in the chemical liquid supply step (S6), the first andsecond magnetic-force generating magnets 125 and 126 are each placed atthe upper position during a predetermined period of time in order toslide the substrate W in the circumferential direction.

In detail, when a predetermined period of time elapses from the start ofthe discharge of a chemical liquid, the controller 3 controls and allowsthe first up-and-down unit 127 to raise the first magnetic-forcegenerating magnet 125 and the second magnetic-force generating magnet126 each of which has been placed at the lower position till then towardthe upper position as shown in FIG. 22D, and, after these magnets riseand reach the upper positions, respectively, these magnets remain to beeach placed at the upper position (magnetic-force generation-positionplacing step). As a result, a state is reached in which the first andsecond magnetic-force generating magnets 125 and 126 are placed at theupper positions, respectively (shown by the solid line in FIG. 10 andFIG. 13).

In the chemical liquid supply step (S6), the substrate W is rotated in astate in which the first and second magnetic-force generating magnets125 and 126 are placed at the upper positions, respectively (rotationstep). As a result, the magnitude of a magnetic force (e.g., attractivemagnetic force) given from the magnetic-force generating magnets 125 and126 each of which is placed at the upper position changes in accordancewith the rotational angle position of the substrate W. This makes itpossible to change a magnetic force (e.g., attractive magnetic force)generated between each driving permanent magnet 156A or 156B and themagnetic-force generating magnets 125, 126 in response to rotation ofthe substrate W. As a result of a change in the pressing force in eachmovable pin 110, the substrate W being in a rotational state becomeseccentric. This eccentric direction DE of the substrate W (see FIG. 14Betc.) changes in accordance with the rotational angle position of thesubstrate W being in a rotational state.

Additionally, in the chemical liquid supply step (S6), a chemical liquidis supplied to the upper surface of the substrate W in parallel torotation of the rotary table 107 with respect to the magnetic-forcegenerating magnet, i.e., in parallel to rotation of the substrate W withrespect to the first and second magnetic-force generating magnets 125and 126. A load imposed onto the substrate W is increased by allowingthe chemical liquid to be supplied to the upper surface of the substrateW under predetermined pressure. The increase of the load acts on thesubstrate W that is in contact with and that is supported by theplurality of support pins (movable pins 110) as rotational resistancethat obstructs the turning of the substrate W. A centrifugal forcegenerated by the rotation of the substrate W also acts on the peripheraledge of the substrate W.

As a result, in the chemical liquid supply step (S6), the substrate Wbeing in a rotational state relatively turns in the turning directionDr2 having a circumferential direction opposite to the rotationaldirection Dr1 with respect to the rotary table 107 and the support pin(movable pin 110). As a result, in the chemical liquid supply step (S6),it is possible to displace the contact-support position in theperipheral edge of the substrate W supported by the support pin (movablepin 110) in the circumferential direction (rotational direction Dr2)while allowing the plurality of support pins (movable pins 110) to comeinto contact with and support the peripheral edge of the substrate W.

When a predetermined period of time (e.g., about 40 seconds) elapsesafter placing each of the first and second magnetic-force generatingmagnets 125 and 126 at the upper position, the controller 3 controls andallows the first up-and-down unit 127 to lower the first and secondmagnetic-force generating magnets 125 and 126 toward the lower positionand to keep each magnet at this lower position as shown in FIG. 22C. Inthis processing example, the first and second magnetic-force generatingmagnets 125 and 126 are each placed at the upper position for about 40seconds, and, as a result, the substrate W deviates (turns) by about 30°with respect to each movable pin 110 in a direction opposite to therotational direction Dr1. Therefore, in the chemical liquid supply step(S6), there is no part in the peripheral edge area of the substrate Wwhere a chemical liquid does not flow around, and it is possible totreat the whole of the peripheral edge area of the substrate W with achemical liquid.

When a predetermined period of time elapses from the start of thedischarge of the chemical liquid, the chemical liquid supply step (S6)is ended. In detail, the controller 3 closes the chemical liquid valve15, and stops to discharge a chemical liquid from the chemical liquidnozzle 6. The controller 3 also moves the chemical liquid nozzle 6 fromthe central position to the home position. Thus, the chemical liquidnozzle 6 is withdrawn from above the substrate W.

Although the operation of placing each of the first and secondmagnetic-force generating magnets 125 and 126 at the upper position isperformed once in the chemical liquid supply step (S6) as describedabove, this operation of placing each of the first and secondmagnetic-force generating magnets 125 and 126 thereat may be performed aplurality of times in the chemical liquid supply step (S6).

Following the end of the chemical liquid supply step (S6), water, whichis a rinse liquid, starts to be supplied to the rear surface Wb of thesubstrate W (S7; Rinse step: Processing-liquid supply step: Rotationprocessing).

In detail, the controller 3 opens and allows the water valve 43 todischarge water from the water nozzle 41 toward the central part of therear surface Wb of the substrate Was shown in FIG. 22E. Water dischargedfrom the water nozzle 41 lands on the central part of the rear surfaceWb of the substrate W covered with the chemical liquid. The water thathas landed on the central part of the rear surface Wb of the substrate Wreceives a centrifugal force generated by the rotation of the substrateW, and flows toward the peripheral edge of the substrate W on the rearsurface Wb of the substrate W, and spreads to the whole area of the rearsurface Wb of the substrate W. Therefore, the chemical liquid present onthe substrate W is outwardly swept away by the water, and is dischargedfrom the substrate W to its surroundings. As a result, the chemicalliquid that has adhered to the rear surface Wb of the substrate W isreplaced by the water.

Additionally, in the rinse step (S7), the first and secondmagnetic-force generating magnets 125 and 126 are each placed at theupper position during a predetermined period of time in order to slidethe substrate W in the circumferential direction.

In detail, when a predetermined period of time elapses from the start ofthe discharge of water, the controller 3 controls and allows the firstup-and-down unit 127 to raise the first magnetic-force generating magnet125 and the second magnetic-force generating magnet 126 each of whichhas been placed at the lower position till then toward the upperposition as shown in FIG. 22F, and, after these magnets rise and reachthe upper positions, respectively, these magnets remain to be eachplaced at the upper position (magnetic-force generation-position placingstep). As a result, a state is reached in which the first and secondmagnetic-force generating magnets 125 and 126 are placed at the upperpositions, respectively (shown by the solid line in FIG. 10 and FIG.13).

In the rinse step (S7), the substrate W is rotated in a state in whichthe first and second magnetic-force generating magnets 125 and 126 areplaced at the upper positions, respectively (rotation step). As aresult, the magnitude of a magnetic force (e.g., attractive magneticforce) given from the magnetic-force generating magnets 125 and 126 eachof which is placed at the upper position changes in accordance with therotational angle position of the substrate W. This makes it possible tochange a magnetic force (e.g., attractive magnetic force) generatedbetween each driving permanent magnet 156A or 156B and themagnetic-force generating magnets 125, 126 in response to rotation ofthe substrate W. As a result of a change in the pressing force in eachmovable pin 110, the substrate W being in a rotational state becomeseccentric. This eccentric direction DE of the substrate W (see FIG. 14Betc.) changes in accordance with the rotational angle position of thesubstrate W being in a rotational state.

Additionally, in the rinse step (S7), water is supplied to the uppersurface of the substrate W in parallel to rotation of the rotary table107 with respect to the magnetic-force generating magnet, i.e., inparallel to rotation of the substrate W with respect to the first andsecond magnetic-force generating magnets 125 and 126. A load imposedonto the substrate W is increased by allowing the water to be suppliedto the upper surface of the substrate W under predetermined pressure.The increase of the load acts on the substrate W that is in contact withand that is supported by the plurality of support pins (movable pins110) as rotational resistance that obstructs the turning of thesubstrate W. A centrifugal force generated by the rotation of thesubstrate W also acts on the peripheral edge of the substrate W.

As a result, in the rinse step (S7), the substrate W being in arotational state relatively turns in the turning direction Dr2 having acircumferential direction opposite to the rotational direction Dr1 withrespect to the rotary table 107 and the support pin (movable pin 110).As a result, in the rinse step (S7), it is possible to displace thecontact-support position in the peripheral edge of the substrate Wsupported by the support pin (movable pin 110) in the circumferentialdirection (rotational direction Dr2) while allowing the plurality ofsupport pins (movable pins 110) to come into contact with and supportthe peripheral edge of the substrate W.

When a predetermined period of time (e.g., about 40 seconds) elapsesafter placing each of the first and second magnetic-force generatingmagnets 125 and 126 at the upper position, the controller 3 controls andallows the first up-and-down unit 127 to lower the first and secondmagnetic-force generating magnets 125 and 126 toward the lower positionand to keep each magnet at this lower position as shown in FIG. 22D. Thefirst and second magnetic-force generating magnets 125 and 126 are eachplaced at the upper position for about 40 seconds, and, as a result, thesubstrate W deviates (turns) by about 30° with respect to each movablepin 110 in a direction (circumferential direction) opposite to therotational direction Dr1. Therefore, in the rinse step (S7), there is nopart in the peripheral edge area of the substrate W where water does notflow around, and it is possible to rinse the whole of the peripheraledge area of the substrate W.

When a predetermined period of time elapses from the start of thedischarge of water, the rinse step (S7) is ended. In detail, thecontroller 3 closes the water valve 43, and stops to discharge waterfrom the water nozzle 41.

Although the operation of placing each of the first and secondmagnetic-force generating magnets 125 and 126 at the upper position isperformed once in the rinse step (S7) as described above, this operationof placing each of the first and second magnetic-force generatingmagnets 125 and 126 thereat may be performed a plurality of times in therinse step (S7).

After the end of the rinse step (S7), a spin dry step (step T10) ofdrying the substrate W is then performed. In detail, the controller 3controls and allows the rotating/driving unit 17 to accelerate thesubstrate W to a dry rotation speed (e.g., several thousand rpm) largerthan the rotation speed in the chemical liquid supply step (S6) and inthe rinse step (S7) and to rotate the substrate W at the dry rotationspeed as shown in FIG. 22G. As a result, a large centrifugal force isapplied to a liquid present on the substrate W, so that the liquidadhering to the substrate W is shaken off from the substrate W towardits surroundings. The liquid is removed from the substrate W in thisway, and the substrate W is dried. In this processing example, the spindry step (S8) is performed while the protective disk 115 is being placedat the approach position.

Thereafter, when a predetermined period of time elapses after thesubstrate W starts to be rotated at a high speed, the controller 3controls and allows the rotating/driving unit 17 to stop the rotation ofthe substrate W by means of the spin chuck 5 (step S9).

Thereafter, the controller 3 controls and allows the second up-and-downunit 130 to lower the second disk-floating magnet 129 toward the lowerposition. As a result, the distance between the second disk-floatingmagnet 129 and the first disk-floating magnet 160 becomes larger, andthe magnetic repulsive force therebetween becomes smaller. Accordingly,the protective disk 115 descends toward the upper surface of the rotarytable 107 (step S10). Therefore, a space that can be entered by the handH2 of the center robot CR is secured between the upper surface of theprotective disk 115 and the front surface Wa (lower surface) of thesubstrate W.

Additionally, in response to the descent of the protective disk 115 fromthe approach position to the lower position, the S-pole portion 124 onthe lower end side of the first opening/closing switching permanentmagnet 121 recedes from the first driving permanent magnet 156A, and,instead, the N-pole portion 123 on the upper end side of the firstopening/closing switching permanent magnet 121 approaches the firstdriving permanent magnet 156A. Additionally, in response to the descentof the protective disk 115 from the approach position to the lowerposition, the N-pole portion 123 on the upper end side of the secondopening/closing switching permanent magnet 122 recedes from the seconddriving permanent magnet 156B, and, instead, the S-pole portion 124 onthe upper end side of the second opening/closing switching permanentmagnet 122 approaches the second driving permanent magnet 156B. As aresult, all of the movable pins 110 are driven from the contact positionto the open position, and are held at the open position. As a result,the substrate W is released from the state of being gripped.

Thereafter, the substrate W is carried out from the inside of theprocessing chamber 4 (see FIG. 22H. step S11), and the substrate Wcarried out therefrom is reversed by the reversing unit TU (step S12).Thereafter, the substrate W that has been washed is contained in thecarrier C in a state in which its front surface Wa is directed upwardly,and is conveyed from the substrate processing apparatus 1 toward apostprocessing device such as an exposure device.

As thus described, according to the present preferred embodiment, theupper shaft portion 152 of each movable pin 110 is pressed against theperipheral edge of the substrate W with a predetermined pressing forceby means of a magnetic force (e.g., attractive magnetic force) generatedbetween the first and second driving permanent magnets 156A, 156B andthe first and second opening/closing switching permanent magnets 121,122, and, as a result, the substrate W is gripped in the horizontaldirection by means of the plurality of support pins (movable pins 110).In the chemical liquid supply step (S6) and the rinse step (S7), thesubstrate W is rotated around the rotational axis A1 by rotating thesupport pin (movable pin 110) and the rotary table 107 around therotational axis A1 in a state in which the substrate W is gripped by theplurality of support pins (movable pins 110), and a centrifugal forcegenerated by the rotation acts on the peripheral edge of the substrateW.

Additionally, the substrate processing apparatus 1 is provided with thefirst magnetic-force generating magnet 125 that has a magnetic pole thatapplies a magnetic force (e.g., attractive magnetic force) urging theupper shaft portion 152 of a corresponding movable pin 110 toward theopen position between the first driving permanent magnet 156A and thefirst magnetic-force generating magnet 125. The substrate processingapparatus 1 is further provided with the second magnetic-forcegenerating magnet 126 that has a magnetic pole that applies a magneticforce (e.g., attractive magnetic force) urging the upper shaft portion152 of a corresponding movable pin 110 toward the open position betweenthe second driving permanent magnet 156B and the second magnetic-forcegenerating magnet 126. In the chemical liquid supply step (S6) and therinse step (S7), the controller 3 places each of the first and secondmagnetic-force generating magnets 125 and 126 at the upper position atwhich the magnitude of a magnetic force (e.g., attractive magneticforce) generated between the first and second driving permanent magnets156A, 156B and the first and second magnetic-force generating magnets125, 126 is smaller than that of a magnetic force (e.g., attractivemagnetic force) generated between the first and second driving permanentmagnet 156A, 156B and the first and second opening/closing switchingpermanent magnets 121, 122. In this state, the rotary table 107 isrelatively rotated around the rotational axis A1. The substrate W isalso rotated around the rotational axis A1 in response to the rotationof the rotary table 107 around the rotational axis A1. Therefore, thedistance between each driving permanent magnet 156A or 156B and themagnetic-force generating magnets 125, 126 changes in accordance withthe rotational angle position of the substrate W, i.e., the magnitude ofa magnetic force (e.g., attractive magnetic force) that is given fromthe magnetic-force generating magnets 125 and 126 and that acts on eachdriving permanent magnet 156A or 156B also changes in accordance withthe rotational angle position of the substrate W. This makes it possibleto change a magnetic force (e.g., attractive magnetic force) generatedbetween each driving permanent magnet 156A or 156B and themagnetic-force generating magnets 125, 126 in response to rotation ofthe substrate W.

Still additionally, in a state in which the first and secondmagnetic-force generating magnets 125 and 126 are placed at the upperpositions, respectively, the magnitude of a magnetic force (e.g.,attractive magnetic force) generated between the driving permanentmagnets 156A, 156B and the magnetic-force generating magnets 125, 126 issmaller than that of a magnetic force (e.g., attractive magnetic force)generated between the driving permanent magnets 156A, 156B and theopening/closing switching permanent magnets 121, 122. Therefore, it ispossible to change the magnitude of a pressing force against theperipheral edge of the substrate W applied by the upper shaft portion152 of the movable pin 110 while keeping its magnitude higher than zeroin response to rotation of the rotary table 107.

In other words, in the chemical liquid supply step (S6) and the rinsestep (S7), it is possible to change a pressing force generated in eachmovable pin 110 while allowing a centrifugal force to act on theperipheral edge of the substrate W. As a result of the change of thepressing force in each movable pin 110, the substrate W being in arotational state becomes eccentric. Accordingly, the eccentric directionDE of the substrate W changes in accordance with the rotational angleposition of the substrate W being in a rotational state.

Additionally, in the chemical liquid supply step (S6) and the rinse step(S7), a processing liquid (chemical liquid or water) is supplied to theupper surface of the substrate W in parallel to rotation of the rotarytable 107 with respect to the magnetic-force generating magnet, i.e., inparallel to rotation of the substrate W with respect to the first andsecond magnetic-force generating magnets 125 and 126. A load imposedonto the substrate W is increased by allowing the processing liquid(chemical liquid or water) to be supplied to the upper surface of thesubstrate W under predetermined pressure. In a state in which thesubstrate W is being rotated, the increase of the load acts on thesubstrate W that is in contact with and that is supported by theplurality of support pins (movable pins 110) as rotational resistancethat obstructs the rotation and movement of the substrate W. Acentrifugal force generated by the rotation of the substrate W also actson the peripheral edge of the substrate W.

Accordingly, the substrate W becomes eccentric in a state in which thesubstrate W is being rotated, and this eccentric direction changes inaccordance with the rotational angle position of the substrate being ina rotational state. In addition to this, when the substrate W being in arotational state is eccentric, a force that obstructs the rotation andmovement of the substrate W that is in contact with and that issupported by the plurality of support pins (movable pins 110) acts onthe substrate W. Therefore, the substrate W being in a rotational staterelatively turns in the turning direction Dr2 that is a circumferentialdirection opposite to the rotational direction Dr1 with respect to therotary table 107 and the support pin (movable pin 110). As a result, inthe chemical liquid supply step (S6) and the rinse step (S7), it ispossible to displace the contact-support position in the peripheral edgeof the substrate W supported by the support pin (movable pin 110) in thecircumferential direction while allowing the plurality of support pins(movable pins 110) to come into contact with and support the peripheraledge of the substrate W. The contact-support position is displaced whileperforming the chemical liquid supply step (S6) and the rinse step (S7),and therefore, in the peripheral edge area of the substrate W, there isno part where a processing liquid (chemical liquid or water) does notflow around. Therefore, it is possible to provide a substrate processingapparatus 1 that is capable of excellently processing the peripheraledge of the substrate W without the remainder after processing.

Additionally, in the present preferred embodiment, the firstmagnetic-force generating magnet 125 and the second magnetic-forcegenerating magnet 126 are alternately disposed in the circumferentialdirection, and therefore the magnetic pole of a magnetic field given tothe first and second driving permanent magnets 156A and 156B changes inresponse to rotation of the rotary table 107 (the magnetic field isnonuniform). In this case, it is possible to abruptly change a magneticforce generated between the first and second driving permanent magnets156A, 156B and the first and second magnetic-force generating magnets125, 126 in accordance with the rotational angle position of thesubstrate W. Therefore, it is possible to largely change a magneticforce generated between each driving permanent magnet 156A or 156B andthe magnetic-force generating magnets 125, 126 in response to rotationof the substrate W, and it is possible to accelerate the turning of thesubstrate W in the turning direction Dr2. This makes it possible to evenmore effectively displace the contact-support positions in theperipheral edge of the substrate W supported by the support pins(movable pins 110) in the circumferential direction.

Additionally, in the chemical liquid supply step (S6) and the rinse step(S7), the first and second magnetic-force generating magnets 125 and 126are moved between the upper position (first position) and the lowerposition (the second position), and, as a result, it is possible to makea transition between a state in which the contact-support position inthe peripheral edge of the substrate W deviates and a state in which thecontact-support position in the peripheral edge of the substrate W doesnot deviate. The amount of displacement in the circumferential directionof the substrate W is proportional to the length of time during whichthe first and second magnetic-force generating magnets 125 and 126 areplaced at the upper positions, respectively, and therefore the first andsecond magnetic-force generating magnets 125 and 126 are each moved fromthe upper position to the lower position in a state in which apredetermined period of time has elapsed after placing each of the firstand second magnetic-force generating magnets 125 and 126 at the upperposition, and, as a result, it is possible to control the amount ofdisplacement in the circumferential direction of the substrate W so asto be set at a desired amount.

FIG. 23 is a pictorial cross-sectional view to describe an arrangementexample of a processing unit 202 included in a substrate processingapparatus according to a second preferred embodiment of the presentinvention. FIG. 24 is a plan view to describe a more concretearrangement of a spin chuck 205 included in the processing unit 202.FIG. 25 is a view showing a positional relationship between the firstand second driving permanent magnets 156A, 156B and the first and secondmagnetic-force generating magnets 125, 126 when the rotary table 107 isrotated in the spin chuck 205.

In the preferred embodiment shown in FIGS. 23 to 25, the same referencesign as in FIGS. 1 to 22B is given to an element corresponding to eachelement of the preferred embodiment shown in FIGS. 1 to 22B, and adescription of this element is omitted.

A main respect in which the spin chuck 205 according to this preferredembodiment differs from the spin chuck 5 according to the aforementionedpreferred embodiment is that the magnetic-force generating magnets areformed of not the plurality of first and second magnetic-forcegenerating magnets 125 and 126 but only a plurality of magnetic-forcegenerating magnets 126. In other words, an arrangement of magnetic-forcegenerating magnets according to the second preferred embodiment isformed by eliminating the first magnetic-force generating magnets 125from the arrangement of the magnetic-force generating magnets accordingto the first preferred embodiment.

In still other words, magnetic-force generating magnets according to thesecond preferred embodiment include a plurality of magnetic-forcegenerating magnets 126 that have mutually-common polar directions in theradial direction. Additionally, these magnetic-force generating magnets126 are spaced out in the circumferential direction. The firstup-and-down unit 127 is joined to the plurality of magnetic-forcegenerating magnets 226. The first up-and-down unit 127 raises and lowersthe plurality of magnetic-force generating magnets 126 together.

The spin chuck 205 of the second preferred embodiment also differs fromthat of the first preferred embodiment in that the six movable pins 110spaced out at the peripheral edge of the upper surface of the rotarytable 107 are all equal to each other in the polar direction of acorresponding driving magnet with respect to the radial direction. Inaddition to this, only one kind of opening/closing switching permanentmagnet (e.g., second opening/closing switching permanent magnet 122) isalso employed as an opening/closing switching permanent magnet (pressingmagnet) that is disposed so as to correspond to each movable pin 110 andthat is used to perform the switching of the upper shaft portion 152 ofthe movable pin 110 between the open position and the holding position.

As described in the first preferred embodiment, in a state in which thesecond magnetic-force generating magnet 126 is placed at the upperposition, a magnetic force (e.g., attractive magnetic force) directed tourge the upper shaft portion 152 (see FIG. 13) of the movable pin 110toward the open position is generated between the second drivingpermanent magnet 156B and the second magnetic-force generating magnet126 so as to have a smaller magnitude than a magnetic force (e.g.,attractive magnetic force) generated between the second drivingpermanent magnet 156B and the second opening/closing switching permanentmagnet 122 when the second magnetic-force generating magnet 126coincides with the second driving permanent magnet 156B with respect totheir rotational directions.

In the rotation processing (chemical liquid supply step (S6 of FIG. 20)and the rinse step (S7 of FIG. 20)), in a state in which the substrate Wis gripped by the plurality of support pins (movable pins 110) (i.e., ina state in which the upper shaft portion 152 of the movable pin 110 isat the contact position and is pressing the peripheral edge of thesubstrate W), the rotating/driving unit 103 rotates the rotary table 107at a speed of the liquid processing speed (e.g., about 500 rpm) in therotational direction Dr1. As a result, the substrate W is rotated aroundthe rotational axis A1, and a centrifugal force generated by therotation acts on the peripheral edge of the substrate W.

In the rotation processing (chemical liquid supply step (S6 of FIG. 20)and the rinse step (S7 of FIG. 20)), the distance between the seconddriving permanent magnet 156B and the second magnetic-force generatingmagnet 126 changes in accordance with the rotational angle position ofthe substrate W. In other words, the magnitude of a magnetic force in anopposite direction that acts on each of the second driving permanentmagnets 156B changes in accordance with the rotational angle position ofthe substrate W. This makes it possible to change a magnetic force(e.g., attractive magnetic force) generated between each of the seconddriving permanent magnets 156B and the second magnetic-force generatingmagnet 126 in response to rotation of the substrate W. The magnitude ofa magnetic force (e.g., attractive magnetic force) generated between thesecond driving permanent magnet 156B and the second magnetic-forcegenerating magnet 126 is smaller than that of a magnetic force (e.g.,attractive magnetic force) generated between the second drivingpermanent magnet 156B and the second opening/closing switching permanentmagnet 122. Therefore, it is possible to change the magnitude of apressing force against the peripheral edge of the substrate W applied bythe upper shaft portion 152 of the movable pin 110 while keeping itsmagnitude higher than zero in response to rotation of the rotary table107.

In other words, in the rotation processing (the chemical liquid supplystep (S6 of FIG. 20) and the rinse step (S7 of FIG. 20)), it is possibleto change a pressing force applied from the upper shaft portion 152 ofeach movable pin 110 while allowing a centrifugal force to act on theperipheral edge of the substrate W. As a result, the substrate W beingin a rotational state becomes eccentric. Additionally, in the same wayas in the first preferred embodiment, the eccentric direction DE (seeFIG. 14B etc.) of the substrate W changes in accordance with therotational angle position of the substrate W being in a rotationalstate.

Therefore, also in the second preferred embodiment, the operation andeffect equivalent to the operation and effect described in the firstpreferred embodiment are fulfilled.

Additionally, in the second preferred embodiment, the plurality ofsecond magnetic-force generating magnets 126 are spaced out in thecircumferential direction, and therefore the magnetic pole of a magneticfield given to the second driving permanent magnet 156B changes inresponse to rotation of the rotary table 107 (the magnetic field isnonuniform). In this case, it is possible to abruptly change a magneticforce (e.g., attractive magnetic force) generated between each seconddriving permanent magnet 156B and the second magnetic-force generatingmagnet 126 in accordance with the rotational angle position of thesubstrate W. Therefore, it is possible to largely change a magneticforce (e.g., attractive magnetic force) generated between each seconddriving permanent magnet 156B and the second magnetic-force generatingmagnet 126 in response to rotation of the substrate W, and it ispossible to accelerate the turning of the substrate W. This makes itpossible to even more effectively displace the contact-support positionsin the peripheral edge of the substrate W supported by the support pins(movable pins 110) in the circumferential direction.

Although the two preferred embodiments of the present invention havebeen described as above, the present invention can be embodied in othermodes.

For example, although each of the upper positions (first positions) ofthe first and second magnetic-force generating magnets 125 and 126 isplaced slightly below the first and second driving permanent magnets156A and 156B in the first and second preferred embodiments as describedabove, each of the upper positions (first positions) of the first andsecond magnetic-force generating magnets 125 and 126 may be placedlaterally with respect to the first and second driving permanent magnets156A and 156B. In this case, the kind of the magnetic-force generatingmagnets 125, 126 or the distance (distance in an approach state) betweenthe magnetic-force generating magnets 125, 126 and the driving permanentmagnets 156A, 156B is appropriately set (selected) so that the magnitudeof a magnetic force generated between the magnetic-force generatingmagnets 125, 126 and the driving permanent magnets 156A, 156B becomessmaller than that of a magnetic force generated between theopening/closing switching permanent magnets 121, 122 and the drivingpermanent magnets 156A, 156B when the magnetic-force generating magnets125, 126, and the driving permanent magnets 156A, 156B coincide witheach other with respect to their rotational directions.

Additionally, in the first preferred embodiment, the up-and-down unitthat raises and lowers the plurality of first magnetic-force generatingmagnets 125 together and the up-and-down unit that raises and lowers theplurality of second magnetic-force generating magnets 126 together maybe used as mutually different units, respectively. Still additionally,in the first and second preferred embodiments, the plurality of firstmagnetic-force generating magnets 125 may be raised and lowered byindividual up-and-down units, respectively, and the plurality of secondmagnetic-force generating magnets 126 may be raised and lowered byindividual up-and-down units, respectively.

Additionally, although the first up-and-down unit 127 is used as anexample of a magnet moving unit in the first and second preferredembodiments as described above, the magnet moving unit may movemagnetic-force generating magnets (the first magnetic-force generatingmagnet 125 and/or the second magnetic-force generating magnet 126) in adirection (e.g., horizontal direction) other than the verticaldirection.

Additionally, although the first magnetic-force generating magnet 125and/or the second magnetic-force generating magnet 126 are/is held in astationary state in the first and second preferred embodiments as anexample as described above, the magnetic-force generating magnets 125,126 may be disposed movably with respect to the rotary table 107.However, the substrate W supported by the support pin and themagnetic-force generating magnets 125 and 126 are required to berelatively rotated in response to rotation of the rotary table 107.

Additionally, although the first disk-floating magnet 160 includes aplurality of magnets spaced out in the circumferential direction in theannular shape coaxial with the rotational axis A1 in the first andsecond preferred embodiments as described above, the first disk-floatingmagnet 160 may have an annular shape coaxial with the rotational axisA1.

Additionally, although the pressing magnet (opening/closing switchingpermanent magnets 121 and 122) that presses the upper shaft portion 152(support portion) against the contact position is provided so as to beraised and lowered in response to the movement of the protective disk115 in the first and second preferred embodiment as an example asdescribed above, the pressing magnet may be attached to the rotary table107, or may be held so as to be raised and lowered (moved) by membersother than the protective disk 115.

Additionally, although the first magnetic-force generating magnets 125and the second magnetic-force generating magnets 126 are each three innumber in the first preferred embodiment as described above, it is onlynecessary for the number to be one or more.

Likewise, in the second preferred embodiment, the number of themagnetic-force generating magnets (second magnetic-force generatingmagnets 126) is not limited to three, and it is only necessary for thenumber to be one or more. Additionally, in the second preferredembodiment, the first magnetic-force generating magnet 125, instead ofthe second magnetic-force generating magnet 126, may be employed as amagnetic-force generating magnet.

Additionally, although the number of the support pins is six asdescribed above, this is an example, and it is only necessary for thenumber to be three or more without being limited to six.

Additionally, although all support pins are formed of the movable pins110 in the present invention as described above, part of the supportpins may be formed of fixed pins each of which has an upper shaftportion 152 that is immovable.

Additionally, although a surface to be processed is a rear surface(device non-forming surface) Wb of a substrate W as described above, afront surface (device forming surface) Wa of the substrate W may be ato-be-processed surface. In this case, it is also possible to eliminatethe reversing unit TU.

Additionally, the series of processing-liquid processing steps may beperformed to remove metals or remove impurities buried in a film withoutbeing limited to the removal of foreign substances. Additionally, theseries of processing-liquid processing steps may be to perform etching,not washing.

Additionally, although a to-be-processed surface is an upper surface ofa substrate W as described above, the to-be-processed surface may be alower surface of the substrate W. In this case, although a processingliquid is supplied to the lower surface of the substrate W, theprocessing liquid is allowed to flow around from the lower surface ofthe substrate W to the upper surface of the substrate W at a substratesupport position in the peripheral edge of the substrate W, and, as aresult, it is possible to excellently process the peripheral edge of thesubstrate W without the remainder after processing by use of theprocessing liquid.

The present invention can also be embodied in parallel to rotationprocessing in which a processing liquid is not supplied to an uppersurface of a substrate W. Even if the processing liquid is not suppliedto the upper surface of the substrate W, the substrate W itself willfunction as rotational resistance in rotation processing if the ownweight of the substrate W supported by support pins is sufficientlyheavy.

Additionally, although the substrate processing apparatus 1 is anapparatus that processes a disk-shaped semiconductor substrate asdescribed above, the substrate processing apparatus 1 may be anapparatus that processes a polygonal substrate, such as a glasssubstrate for liquid crystal display devices.

Although the preferred embodiments of the present invention have beendescribed in detail, these embodiments are merely concrete examples usedto clarify the technical contents of the present invention, and thepresent invention should not be understood by being limited to theseconcrete examples, and the scope of the present invention is limitedsolely by the appended claims.

What is claimed is:
 1. A substrate processing apparatus comprising: asubstrate rotation holding device including a rotary table that isrotatable around a rotational axis along a vertical direction, and aplurality of support pins to support a substrate horizontally, theplurality of support pins disposed to rotate around the rotational axistogether with the rotary table, wherein the plurality of support pinsincludes a movable pin that has a support portion disposed movablybetween a contact position at which the support portion comes intocontact with a peripheral edge of the substrate and an open positionthat is more distant from the rotational axis than the contact position;the substrate processing apparatus further comprising: a driving magnetthat is coupled to the movable pin and that has a predetermined polardirection with respect to a radial direction of the rotary table; apressing magnet that has a magnetic pole and is arranged for applying anattractive magnetic force or a repulsive magnetic force between thedriving magnet and the pressing magnet so as to press the supportportion against the peripheral edge of the substrate by urging thesupport portion toward the contact position by means of the attractivemagnetic force or the repulsive magnetic force; a rotating/driving unitthat rotates the rotary table together with the plurality of supportpins and the driving magnet coupled to the movable pin around therotational axis; and a pressing-force changing unit that changes amagnitude of a pressing force against the peripheral edge of thesubstrate pressed by the support portion in response to rotation of therotary table around the rotational axis while keeping the magnitude ofthe pressing force higher than zero; wherein the pressing-force changingunit comprises a magnetic-force generating magnet that is a magnetdiffering from the pressing magnet, and that has a magnetic pole thatgives an attractive magnetic force or a repulsive magnetic force betweenthe driving magnet and the magnetic-force generating magnet to urge thesupport portion toward the open position, the magnetic-force generatingmagnet being partially disposed on a circumference centered on therotational axis; a magnet drive unit that drives the magnetic-forcegenerating magnet; and a pressing-force changing control unit thatcontrols the magnet drive unit so as to place the magnetic-forcegenerating magnet at a first position at which an attractive magneticforce or a repulsive magnetic force is generated between the drivingmagnet and the magnetic-force generating magnet with a smaller magnitudethereof than an attractive magnetic force or a repulsive magnetic forcegenerated between the driving magnet and the pressing magnet.
 2. Thesubstrate processing apparatus according to claim 1, wherein themagnetic-force generating magnet includes a plurality of magnetic-forcegenerating magnets that are disposed on the circumference centered onthe rotational axis, and that have mutually identical polar directionswith respect to the radial direction of the rotary table, and theplurality of magnetic-force generating magnets are spaced out in acircumferential direction around the rotational axis.
 3. The substrateprocessing apparatus according to claim 1, wherein the magnet drive unitincludes a magnet moving unit that moves the magnetic-force generatingmagnet between the first position and a second position at which amagnetic field is not generated between the driving magnet and themagnetic-force generating magnet.
 4. The substrate processing apparatusaccording to claim 1, further comprising a processing liquid supply unitthat supplies a processing liquid to an upper surface of the substratesupported by the plurality of support pins rotated together with therotary table by the rotating/driving unit.